EEWORLDEEWORLDEEWORLD

Part Number

Search

LD176CM474AB2A

Description
Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.47uF, Surface Mount, 0508, CHIP
CategoryPassive components    capacitor   
File Size183KB,1 Pages
ManufacturerAVX
Download Datasheet Parametric View All

LD176CM474AB2A Overview

Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.47uF, Surface Mount, 0508, CHIP

LD176CM474AB2A Parametric

Parameter NameAttribute value
MakerAVX
package instruction, 0508
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.47 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee0
Manufacturer's serial numberLD17
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, PAPER, 7 INCH
positive tolerance20%
Rated (DC) voltage (URdc)6.3 V
size code0508
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceTIN LEAD
Terminal shapeWRAPAROUND
Low Inductance Capacitors (SnPb)
LICC 0612/0508/0306 X7R & X5R Dielectric
The total inductance of a chip capacitor is determined both by its length to width ratio and
by the mutual inductance coupling between its electrodes.
Thus a 1210 chip size has a lower inductance than a 1206 chip. This design improvement is
the basis of AVX’s Low Inductance Chip Capacitors (LICC), where the electrodes are termi-
nated on the long side of the chip instead of the short side. The 1206 becomes an 0612, in
the same manner, an 0805 becomes an 0508, an 0603 becomes an 0306. This results in a
reduction in inductance from the 1nH range found in normal chip capacitors to less than
0.2nH for LICCs. Their low profile is also ideal for surface mounting (both on the PCB and on
IC package) or inside cavity mounting on the IC itself.
Check for up-to-date CV Tables at
MLCC
LICC
http://www.avx.com/docs/catalogs/licc.pdf
HOW TO ORDER
LD18
Size
LD16
LD17
LD18
Z
Voltage
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
D
Dielectric
C = X7R
D = X5R
105
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
M
Capacitance
Tolerance
K = ±10%
M = ±20%
A
Failure Rate
A = N/A
B
Terminations
B = 5% min lead
2
Packaging
Available
2 = 7" Reel
4 = 13" Reel
A
Thickness
Thickness
mm (in)
0.56 (0.022)
0.61 (0.024)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
SIZE
Soldering
Packaging
(L) Length
(W) Width
Cap
(pF)
Cap
(µF)
MM
(in.)
MM
(in.)
WVDC
1000
2200
4700
0.010
0.015
0.022
0.047
0.068
0.10
0.15
0.22
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
WVDC
LD16
Reflow Only
All Paper
0.81 ± 0.15
(0.032 ± 0.006)
1.60 ± 0.15
(0.063 ± 0.006)
16
A
A
A
A
A
A
A
A
A
LD17
Reflow Only
All Paper
1.27 ± 0.25
(0.050 ± 0.010)
2.00 ± 0.25
(0.080 ± 0.010)
16
S
S
S
S
S
S
S
S
V
V
A
A
LD18
Reflow/Wave
Paper/Embossed
1.60 ± 0.25
(0.063 ± 0.010)
3.20 ± 0.25
(0.126 ± 0.010)
16
S
S
S
S
S
S
S
S
S
S
V
V
W
A
6.3
A
A
A
A
A
A
A
A
A
A
A
10
A
A
A
A
A
A
A
A
A
A
A
25
A
A
A
A
A
A
50
6.3
S
S
S
S
S
S
S
S
S
S
S
V
A
A
A
10
S
S
S
S
S
S
S
S
S
S
S
V
A
A
25
S
S
S
S
S
S
V
A
A
50
V
V
V
V
V
V
A
A
A
6.3
S
S
S
S
S
S
S
S
S
S
S
S
V
V
W
A
A
10
S
S
S
S
S
S
S
S
S
S
S
S
V
V
W
A
25
S
S
S
S
S
S
S
V
V
W
50
V
V
V
V
W
W
W
W
W
W
6.3
10
16
25
50
6.3
10
16
25
50
6.3
10
16
25
50
SIZE
0306
0508
0612
0306
Code
A
Thickness
0.61 (0.024)
Code
S
V
A
0508
Thickness
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
Code
S
V
W
A
0612
Thickness
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
Solid = X7R
= X5R
29
Low Inductanace
Capacitors
DSP System Power Management Technology
In portable applications, low power consumption is a key differentiator, determining product size and operating time. For example, if you choose a portable DVD player as a distraction during a cross-o...
zbz0529 Power technology
Year-end summary: First taste of the coder's taste, mixed feelings in my heart
I came to my current company in December 2015. At that time, I had not graduated yet. I was recommended by the school to this company. Now it has been exactly one year. I became a regular employee in ...
596937862 Talking
About the problem in microcomputer assembly: les bx,dword ptr es:[bx]
I saw the instruction description of les in some books, which said that the segment address is sent to es, and the offset address is sent to the destination register (bx). The addressing using the seg...
lixin811013 Embedded System
Recommend a WiFi wireless network card/Bluetooth module with more information
I have successfully written the usb, iic, spi and keyboard drivers on ce5. I think I can write the WiFi wireless network card/Bluetooth driver. Can you recommend a WiFi wireless network card/Bluetooth...
yangrui7202 Embedded System
[Home Smart Lighting Control and Indoor Environment Monitoring System] --10. Project Closing Post
[i=s]This post was last edited by a media student on 2021-7-17 18:12[/i]Home smart lighting control and indoor environment monitoring system0. IntroductionThis competition is another challenge to my b...
传媒学子 onsemi and Avnet IoT Innovation Design Competition
TI graphics library transplantation advice
#define Canvas(sName, pParent, pNext, pChild, pDisplay, lX, lY, lWidth,lHeight, ulStyle, ulFillColor, ulOutlineColor, ulTextColor,pFont, pcText, pucImage, pfnOnPaint) \tCanvasWidget sName = CanvasStru...
蓝雨夜 Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 670  566  2746  2538  2604  14  12  56  52  53 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号