Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
1% Thick Film Chip Resistors
CHARACTERISTICS
(Cont.)
Characteristics
Limits
Test Methods
( JIS C 5201-1 )
7.4 Resistance change after continuous
5 cycles for duty shown below:
Step
Temperature
1
-55°C ±3°C
2
Room temp.
3
+155°C ±2°C
4
Room temp.
CR1 Series
Temperature
cycling
± (1.0% + 0.05Ω) Max.
Time
30 mins
10~15 mins
30 mins
10~15 mins
Load life in
humidity
Resistance change rate is
± (3.0% + 0.1Ω) Max.
7.9 Resistance change after 1,000 hours
(1.5 hours "on", 0.5 hour "off") at RCWV
in a humidity chamber controlled at
40°C ± 2°C and 90 to 95 % relative humidity
7.10 Permanent resistance change after 1,000 hours
Application time of soldering iron: 3 +1/-0 seconds
Load life
Resistance change rate is
± (3.0% + 0.1Ω) Max.
Soldering Heat
Electrical characteristics shall be satisfied.
Without distinct deformation in
appearance.
Solderability
95% Coverage min.
6.5 Test temperature of solder: 245° ±3°C
Dipping them solder: 2~3 seconds
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600036
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
Mouser Electronics
Authorized Distributor
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