Packaging Information / Reference Pattern Layout Dimensions
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USP-4
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Packaging Information
Unit: mm
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Reference Pattern Layout Dimension
Note : reference metal mask design
●USP-4
Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1.
Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient Temperature (85℃)
Evaluation Board (Unit: mm)
Board Mount (Tjmax=125℃)
Ambient
Temperature
(℃)
25
85
Power
Dissipation
Pd (mW)
1000
400
Thermal
Resistance
(℃/W)
100.00
3. Power Dissipation vs. Ambient Temperature (105℃)
Pd vs. Ta
Board Mount (Tjmax=125℃)
Pd vs. Ta
Power Dissipation Pd (mW)
Ambient
Temperature
(℃)
25
85
Power
Dissipation
Pd (mW)
1000
200
Thermal
Resistance
(℃/W)
100.00
Ambient Temperature Ta(℃)