8MP612L100S datasheet, PDF - EEWORLD Datasheet

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8MP612L100S: DescriptionSRAM Module, 32KX16, 100ns, CMOS, PSMA40, PLASTIC, SIP-40; Categorystorage storage; File Size331KB，7 Pages; ManufacturerIDT (Integrated Device Technology)

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8MP612L100S Overview

SRAM Module, 32KX16, 100ns, CMOS, PSMA40, PLASTIC, SIP-40

8MP612L100S Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
package instruction	, SIP40,.1
Reach Compliance Code	not_compliant
Maximum access time	100 ns
I/O type	COMMON
JESD-30 code	R-PSMA-T40
JESD-609 code	e0
memory density	524288 bit
Memory IC Type	SRAM MODULE
memory width	16
Number of functions	1
Number of terminals	40
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
Encapsulate equivalent code	SIP40,.1
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.0003 A
Minimum standby current	4.5 V
Maximum slew rate	0.15 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	SINGLE
Maximum time at peak reflow temperature	30

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8MP612L100S Related Products

	8MP612L100S	8MP612L85S	8MP624L70S	8MP624L100S	8MP612L70S	8MP624L85S
Description	SRAM Module, 32KX16, 100ns, CMOS, PSMA40, PLASTIC, SIP-40	SRAM Module, 32KX16, 85ns, CMOS, PSMA40, PLASTIC, SIP-40	SRAM Module, 64KX16, 70ns, CMOS, PSMA40, PLASTIC, SIP-40	SRAM Module, 64KX16, 100ns, CMOS, PSMA40, PLASTIC, SIP-40	SRAM Module, 32KX16, 70ns, CMOS, PSMA40, PLASTIC, SIP-40	SRAM Module, 64KX16, 85ns, CMOS, PSMA40, PLASTIC, SIP-40
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	, SIP40,.1	, SIP40,.1	, SIP40,.1	, SIP40,.1	, SIP40,.1	, SIP40,.1
Reach Compliance Code	not_compliant	_compli	not_compliant	not_compliant	_compli	_compli
Maximum access time	100 ns	85 ns	70 ns	100 ns	70 ns	85 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PSMA-T40	R-PSMA-T40	R-PSMA-T40	R-PSMA-T40	R-PSMA-T40	R-PSMA-T40
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	524288 bit	524288 bi	1048576 bit	1048576 bit	524288 bi	1048576 bi
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	40	40	40	40	40	40
word count	32768 words	32768 words	65536 words	65536 words	32768 words	65536 words
character code	32000	32000	64000	64000	32000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	32KX16	32KX16	64KX16	64KX16	32KX16	64KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Encapsulate equivalent code	SIP40,.1	SIP40,.1	SIP40,.1	SIP40,.1	SIP40,.1	SIP40,.1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.0003 A	0.0003 A	0.0004 A	0.0004 A	0.0003 A	0.0004 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.15 mA	0.15 mA	0.15 mA	0.15 mA	0.15 mA	0.15 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
Maximum time at peak reflow temperature	30	30	30	30	30	30
Maker	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

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