= 2.7 V to 5.25 V, unless otherwise noted. All specifications are for −40°C to +150°C, unless otherwise noted.
Table 1. A Grade Specifications
Parameter
TEMPERATURE SENSOR AND ADC
Accuracy
1
Min
Typ
±0.5
Max
±1
±2
±3
±4
2
Unit
°C
°C
°C
°C
°C
sec
ms
sec
V
mA
µA
mA
µA
µA
µA
µA
µW
mW
µW
µW
µW
µW
µW
µW
V
V
µA
pF
Test Conditions/Comments
V
DD
= 3.3 V (±10%) and 5 V (±5%)
T
A
= 0°C to 70°C
T
A
= −20°C to +85°C
T
A
= −40°C to +125°C
T
A
= −40°C to +150°C
Temperature measurement every 1.5 second
Temperature Resolution
Autoconversion Update Rate, t
R
Temperature Conversion Time
Thermal Time Constant
3
SUPPLIES
Supply Voltage
Supply Current
Normal Mode
0.03125
1.5
1.2
2
2.7
1.6
190
1.6
280
0.2
0.4
5.25
2.2
300
2.2
400
1
2
20
For specified performance
V
DD
= 3.3 V, powered up and converting
V
DD
= 3.3 V, powered up and not converting
V
DD
= 5 V, powered up and converting
V
DD
= 5 V, powered up and not converting
V
DD
= 3.3 V, T
A
= 0°C to 70°C
V
DD
= 5 V, T
A
= 0°C to 70°C
V
DD
= 2.7 V to 5.25 V, T
A
= −40°C to +150°C
V
DD
= 3.3 V, autoconversion update, t
R
V
DD
= 5 V, autoconversion update, t
R
V
DD
= 3.3 V
V
DD
= 5 V
V
DD
= 3.3 V
V
DD
= 5 V
V
DD
= 3.3 V
V
DD
= 5 V
Shutdown Mode
Power Dissipation
Normal Mode (Average)
Shutdown Mode (Average)
4
1 SPS
10 SPS
100 SPS
DIGITAL INPUT
5
Input High Voltage, V
IH
Input Low Voltage, V
IL
Input Current, I
IN
Input Capacitance, C
IN
DIGITAL OUTPUT
5
Output High Voltage, V
OH
Output Low Voltage, V
OL
Output Capacitance, C
OUT
1
2
631
1.41
4.88
7.4
42.9
65
423
641
2.5
0.8
±1
10
V
DD
− 0.3 V
0.4
50
V
IN
= 0 V to V
DD
All digital inputs
I
SOURCE
= I
SINK
= 200 µA
I
OL
= 200 µA
V
pF
The accuracy specifications for 0°C to 70°C are specified to 3.5-Σ performance.
It is not recommended to operate the device at temperatures above 125°C for greater than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure
beyond this limit affects device reliability.
3
The thermal time constant is the time it takes for a temperature delta to change to 63.2% of its final value. For example, if the ADT7301 experiences a thermal shock
from 0°C to 100°C, it would take typically 2 seconds for the ADT7301 to reach 63.2°C.
4
The ADT7301 is taken out of shutdown mode and a temperature conversion is immediately performed after this write operation. When the temperature conversion is
complete, the ADT7301 is put back into shutdown mode.
5
Guaranteed by design and characterization, not production tested.
Rev. B | Page 3 of 16
ADT7301
TIMING CHARACTERISTICS
Guaranteed by design and characterization, not production tested. All input signals are specified with t
R
= t
F
= 5 ns (10% to 90% of V
DD
)
and timed from a voltage level of 1.6 V. T
A
= T
MIN
to T
MAX
, V
DD
= 2.7 V to 5.25 V, unless otherwise noted.
Table 2.
Parameter
1
t
1
t
2
t
3
t
4 2
t
5
t
6
t
7
t
8 2
1
2
Limit
5
25
25
35
20
5
5
40
Unit
ns min
ns min
ns min
ns max
ns min
ns min
ns min
ns max
Comments
CS to SCLK setup time
SCLK high pulse width
SCLK low pulse width
Data access time after SCLK falling edge
Data setup time prior to SCLK rising edge
Data hold time after SCLK rising edge
CS to SCLK hold time
CS to DOUT high Impedance
See Figure 14 for the SPI timing diagram.
Measured with the load circuit of Figure 2.
200µA
I
OL
TO
OUTPUT
PIN
1.6V
C
L
50pF
02884-0-002
200µA
I
OH
Figure 2. Load Circuit for Data Access Time and Bus Relinquish Time
Rev. B | Page 4 of 16
ADT7301
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
V
DD
to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Operating Temperature Range
1
Storage Temperature Range
Junction Temperature
6-Lead SOT-23 (RJ-6)
Power Dissipation
2
Thermal Impedance
θ
JA
, Junction-to-Ambient
(Still Air)
8-Lead MSOP (RM-8)
Power Dissipation
2
Thermal Impedance
4
θ
JA
, Junction-to-Ambient
(Still Air)
θ
JC
, Junction-to-Case
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
IR Reflow Soldering—Pb-Free Package
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
1
Rating
−0.3 V to +7 V
−0.3 V to V
DD
+ 0.3 V
−0.3 V to V
DD
+ 0.3 V
−40°C to +150°C
−65°C to +150°C
150°C
W
MAX
= (T
J
max − T
A3
)/θ
JA
190.4°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.2
MAXIMUM POWER DISSIPATION (W)
1.0
0.8
SOT-23
0.6
W
MAX
= (T
J
max − T
A3
)/θ
JA
205.9°C/W
43.74°C/W
220°C (0°C/5°C)
10 sec to 20 sec
3°C/s max
−6°C/s max
6 minutes max
260°C (0°C)
20 sec to 40 sec
3°C/s max
−6°C/s max
8 minutes max
0.4
MSOP
0.2
TEMPERATURE (°C)
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
ESD CAUTION
It is not recommended to operate the ADT7301 at temperatures above
125°C for greater than a total of 5% (5,000 hours) of the lifetime of the
device. Any exposure beyond this limit affects device reliability.
2
Values relate to the package being used on a standard 2-layer PCB. Refer
to Figure 3 for a plot of maximum power dissipation vs. ambient
temperature (T
A
).
3
T
A
= ambient temperature.
4
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled,
京公网安备 11010802033920号
EEWORLD
