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XSFM12030900F

Description
RESISTOR, THIN FILM, 0.25 W, 1 %, 250 ppm, 3090 ohm, SURFACE MOUNT, 0202, CHIP
CategoryPassive components    The resistor   
File Size106KB,3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

XSFM12030900F Overview

RESISTOR, THIN FILM, 0.25 W, 1 %, 250 ppm, 3090 ohm, SURFACE MOUNT, 0202, CHIP

XSFM12030900F Parametric

Parameter NameAttribute value
Objectid1217891202
package instruction, 0202
Reach Compliance Codeunknown
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.5
Manufacturer's serial numberSFM
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance3090 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient250 ppm/°C
Terminal shapeONE SURFACE
Tolerance1%
Operating Voltage100 V
SFM
Vishay Electro-Films
Thin Film Top-Contact Resistor
CHIP
RESISTORS
FEATURES
Wire bondable
Product may not
be to scale
Small size: 0.020 inches square
Resistance range: 1.0
Ω
to 1 MΩ
DC power rating: 250 mW
Oxidized silicon substrate for good power dissipation
Resistor material tantalum nitride, self passivating
Moisture resistant
The SFM series single-value resistor chips offer a small size,
wide ohmic value range and excellent power capacity.
The SFMs tantalum nitride resistor material offers excellent
resistance to high moisture environments.
The SFMs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The SFMs are 100 % electrically tested and
visually inspected to MIL-STD-883.
APPLICATIONS
Vishay EFI SFM top-contact resistor chips are designed to handle substantial power loads in many types of hybrid packages.
They are ideally suited for this purpose because of their small size.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
1%
0.5 %
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
PROCESS CODE
CLASS H*
050
051
045
040
*MIL-PRF-38534 inspection criteria
CLASS K*
123
122
121
120
1
Ω
10
Ω
30
Ω
100
Ω
200 kΩ 360 kΩ 620 kΩ 1 MΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
- 250 kΩ
< 100
Ω
or > 251 kΩ
Moisture Resistance, MIL-STD-202
Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
- 35 dB typ.
- 20 dB typ.
± 0.5 % max.
ΔR/R
± 0.25 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.5 % max.
ΔR/R
200 V
10
12
min.
100 V max.
250 mW
± 0.25 % max.
ΔR/R
www.vishay.com
38
For technical questions, contact: efi@vishay.com
Document Number: 61017
Revision: 12-Mar-08
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