EEWORLDEEWORLDEEWORLD

Part Number

Search

3.0SMCJ8.5-H

Description
Trans Voltage Suppressor Diode, 3000W, 8.5V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, SMC-F, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size73KB,9 Pages
ManufacturerFORMOSA
Websitehttp://www.formosams.com/
Download Datasheet Parametric View All

3.0SMCJ8.5-H Overview

Trans Voltage Suppressor Diode, 3000W, 8.5V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, SMC-F, 2 PIN

3.0SMCJ8.5-H Parametric

Parameter NameAttribute value
MakerFORMOSA
package instructionSMC-F, 2 PIN
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresEXCELLENT CLAMPING CAPABILITY
Maximum breakdown voltage10.4 V
Minimum breakdown voltage9.44 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-214AB
JESD-30 codeR-PDSO-C2
Maximum non-repetitive peak reverse power dissipation3000 W
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation6.5 W
Maximum repetitive peak reverse voltage8.5 V
surface mountYES
technologyAVALANCHE
Terminal formC BEND
Terminal locationDUAL
SMD Transient Voltage Suppressor
3.0SMCJ Series
List
Formosa MS
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3~4
Rating and characteristic curves........................................................ 4~5
Pinning information........................................................................... 6
Suggested solder pad layout............................................................. 6
Packing information.......................................................................... 7
Reel packing.................................................................................... 8
Suggested thermal profiles for soldering processes............................. 8
High reliability test capabilities........................................................... 9
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2008/02/10
Revised Date
2013/03/01
Revision
D
Page.
9
Page 1
DS-221815
How can I get started with wdm driver development?
I have just started learning wdm driver development. Could you please give me some advice on how to avoid detours and get started as soon as possible? Can you recommend some books?...
jw_1001 Embedded System
(Watchdog) MAX6034 microprocessor monitoring chip 51 system application example (schematic diagram + source program)
[size=5]MAX6034 is a dedicated, high-performance, low-power microprocessor monitoring chip. The monitoring of the single-chip microcomputer only requires hardware circuits, while the watchdog function...
cooljewel Embedded System
Why is the DC characteristic of this filter not a straight line?
I used an online design tool to generate a low-pass filter, and tried it under simulation software. The AC characteristics were fine, but why is the DC characteristic a broken line with two bends? Why...
飞鸿浩劫 Analog electronics
Cadence library management.
Cadence library management....
fighting PCB Design
What are the system resources that arm user mode cannot access?
I googled a lot and all of them said "some resources". I am a little confused. Does "some resources" only refer to the special registers in different working modes of arm? In my current project, I can...
zhangwf ARM Technology
I just started learning WINCE. There are two ways to implement it. When allocating physical memory, I encountered a problem.
Two methods to implement physical memory allocation: 1 pOpen->pDriverInfo->pVIMRegs[VIN_MB1] = (unsigned long)AllocPhysMem(0x80000, PAGE_READWRITE, 0, 0, (PULONG)0x09000000); 2 pOpen->pDriverInfo->pVI...
jasonb Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1676  1735  2640  282  2210  34  35  54  6  45 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号