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3-MCB-11D0-F

Description
Fixed Resistor, Thin Film, 0.1W, 11ohm, 1% +/-Tol, 50ppm/Cel, Surface Mount, 0505, CHIP
CategoryPassive components    The resistor   
File Size1MB,2 Pages
ManufacturerAPI Technologies
Websitehttp://www.apitech.com/about-api
Download Datasheet Parametric View All

3-MCB-11D0-F Overview

Fixed Resistor, Thin Film, 0.1W, 11ohm, 1% +/-Tol, 50ppm/Cel, Surface Mount, 0505, CHIP

3-MCB-11D0-F Parametric

Parameter NameAttribute value
MakerAPI Technologies
package instructionCHIP
Reach Compliance Codecompliant
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package shapeRECTANGULAR PACKAGE
Rated power dissipation(P)0.1 W
Rated temperature70 °C
resistance11 Ω
Resistor typeFIXED RESISTOR
size code0505
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceGOLD
Terminal shapeONE SURFACE
Tolerance1%

3-MCB-11D0-F Preview

M
ICROWAVE
C
HIP
R
ESISTORS
Thin Film on Ceramic
F
EATURES
• Low VSWR: < 1.2 at 8 GHz
• Low TCR 0 to -50 ppm
:
• Four Sizes:
0.020 X 0.040 to 0.100 X 0.100 inches
• Wire Bond / Solder Mount Option
Spectrum Microwave
Chip Resistors are produced with
state-of-the-art thin film sputtering techniques on microwave
grade alumina. The advantages of sputtered over evaporated
metal films include better adhesion to the substrate, increased
reliability, and more uniform composition, density, and
thickness. Their T
CR
, noise level, and stability are similar to
discrete metal film resistors. The small size and careful
design of Spectrum Microwave Chip Resistors result in low
VSWR and low parasitics. They are available with gold pads
for wire bonding or solder bumps for surface mounting.
MCB/MCG (B
ARE
B
ACK
/G
OLD
B
ACK
)
The MCB and MCG resistors have gold terminations for wirebonds,
although epoxy may also be used. MCB resistors have no backside
metallization. They are die-mounted with epoxy. MCG resistors have
a gold backside metallization. The metallization is electronically
isolated from the front terminations.
.003
TYP.
.010 MIN.
.003 TYP.
T = .010
±
.001
L
±
.005
W
±
.005
T = .020 MAX.
.010 MIN.
.003 TYP.
0.003 TYP.
MCS (S
OLDER
B
UMP
)
MCS resistors have solder bump terminations for flip-chip surface
mounting. They have no backside metallizing. They can also be
die-mounted with epoxy with solder bumps exposed for connection.
O
RDERING
I
NSTRUCTIONS
Construct Part Number From Choices:
___________ - _____________________- ___________
_-
(size)
(type)
(ohms)*
(tolerance)
2
MCB
D = 0.5%
3
MCG
F = 1%
4
MCS
J = 5%
5
K = 10%
W
±
.005
L
±
.005
Example: 2-MCS-1001-J
(Example is a 0.020-by-0.040-inch chip with solder-bump
terminations, 1000 ohms ±5% resistance.)
*First 3 digits are significant figures. Fourth is number of zeros to follow or D for decimal between second and third digits.
Tel: 508-485-6350 Fax: 508-485-5168
165 Cedar Hill Street, Marlborough, Ma 01752
www.SpectrumMicrowave.com
Spectrum Microwave
M
ICROWAVE
C
HIP
R
ESISTORS
Thin Film on Ceramic
S
PECIFICATIONS
Substrate:
Material . . . . . . . . . . . . . . . . . . . . . . . .99.6% Al
2
O
3
Thickness . . . . . . . . . . . . . . . . . . .0.010 ± 0.001 in.
Conductor Film Thickness:
MCB
Nichrome . . . . . . . . . . . . .As required for resistivity
Titungsten . . . . . . . . . . . . . . . . . . . . . . .700Å min.
Gold . . . . . . . . . . . . . . . . . . . . . . . . . .100µ in. min.
MCG
Front . . . . . . . . . . . . . . . . . . . . . . . . .same as MCB
Back
Titungsten . . . . . . . . . . . . . . . . . . .250 ± 100Å
Gold . . . . . . . . . . . . . . . . . . . . . .100µ in. min.
MCS
Nichrome . . . . . . . . . . . . .As required for resistivity
Titungsten . . . . . . . . . . . . . . . . . . . .700Å min.
Gold . . . . . . . . . . . . . . . . . . . . . . . .7µ in. min.
Nickel . . . . . . . . . . . . . . . . . . . . . .10µ in. min.
Gold . . . . . . . . . . . . . . . . . . . . . . .30µ in. min.
Solder (60/40) . . . . . . . . . . . . . .1 to 3 mils typ
T
YPICAL
E
LECTRICAL
D
ATA
T
CR
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .0 to -50 ppm
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°
to +150°C
Noise: . . . . . . . . . . . . . . . . . . . . . . . . . . . .< 0.1 mV/V
VSWR . . . . . . . . . . . . . . . . . . . . . . . . .< 1.2 to 8 GHz
VSWR . . . . . . . . . . . . . . . . . . . . . .
1.48 to 18 GHZ
<
Dielectric k . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9.9
Dissipation Factor . . . . . . . . . . . . . . . . . . . . . . .0.001
Loss Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.0001
Specifications subject to change without notice.
S
IZES
/ P
OWER
/ R
ESISTANCE
R
ANGE
Dimensions
(Inches)
Size 2:
0.020 X 0.040
Size 3:
0.050 X 0.050
Size 4:
0.50 X 0.100
Size 5:
0.100 X 0.100
Power*
(mW)
75
100
150
250
Range
(ohms)
10 to 3000
10 to 1500
10 to 1500
10 to 1500
*Maximum continuous rating at 70°C when bonded to substrate.
Derate to zero at 150°C.
Spectrum Microwave
also manufactures Custom Substrates on a variety of materials, a wide range of Microwave, PIN
Diode Drivers, and Custom Hybrid Circuits. Please contact the factory or your local representative for more information.

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