In principle, it should not happen, because 24LC01 is at A2, A3, while pcf8563 is at A0, A1, but now a conflict does occur. The performance is as follows:
Two devices connected to an i2c bus, when rea...
[font=微软雅黑][size=4][color=#000000]I went to NXP's press conference this morning (Conference Speech PPT:). [/color][/size][/font][font=微软雅黑][size=4][color=#000000] [/color][/size][/font] [font=微软雅黑][si...
[font=楷体_GB2312][size=3]Introduction to Digital Integrated Circuit Design – From HDL to Layout Yu Dunshan Department of Microelectronics, Peking University ?Introduction to Verilog HDL, including: – A...
On August 23rd, Geely's subsidiary, Jiyao Tongxing, announced it has the industry's largest advanced production capacity for tandao
batteries
, with eight production bases across China. Jiy...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
EtherCAT (Ethernet for Control Automation Technology) is a real-time industrial fieldbus communication protocol based on an Ethernet-based development framework. EtherCAT is one of the fastest indu...[Details]
Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
When you are happily watching NBA or football, your wife asks you to turn off the lights in the bedroom. Would you be depressed? Of course, unless you are not afraid of your wife.
Now you are ...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Based on a survey of more than ten intelligent robot companies, this article sorts out and analyzes the current development status of the intelligent industry and the challenges and differences it ...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
The range of an electric vehicle is crucial to the driving experience, and range anxiety is a common headache when driving an electric vehicle. Although the latest electric vehicles can achieve a r...[Details]
Summer is the peak season for buying and using air conditioners. Do you pay attention to the energy efficiency of your air conditioner? Did you buy a DC inverter air conditioner? Do you know the re...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
The fracture mechanism is stress concentration, which typically occurs at the capacitor lead pins or pad connection points, as shown in the figure. Under vibration, the capacitor lead pins and pad ...[Details]
Batteries are a core component of new energy vehicles, accounting for over 40% of the total cost. This is also the area where automakers are most willing to tamper with costs. Since 2021, domestic ...[Details]
introduction
As core electronic components used in vastly different fields, automotive-grade chips and mobile/consumer-grade chips exhibit significant differences in their...[Details]