Standard SRAM, 32KX8, 10ns, CMOS, PDSO28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| package instruction | TSSOP, TSSOP28,.53,22 |
| Reach Compliance Code | unknown |
| Maximum access time | 10 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e0 |
| memory density | 262144 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP28,.53,22 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.08 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.55 mm |
| Terminal location | DUAL |





| KM68257ELTI-10 | KM68257ELT-12 | KM68257EJI-10 | KM68257ELT-15 | KM68257ET-15 | KM68257ELTI-12 | KM68257ELJI-10 | KM68257AP-35 | |
|---|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 32KX8, 10ns, CMOS, PDSO28 | Standard SRAM, 32KX8, 12ns, CMOS, PDSO28 | Standard SRAM, 32KX8, 10ns, CMOS, PDSO28 | Standard SRAM, 32KX8, 15ns, CMOS, PDSO28 | Standard SRAM, 32KX8, 15ns, CMOS, PDSO28 | Standard SRAM, 32KX8, 12ns, CMOS, PDSO28 | Standard SRAM, 32KX8, 10ns, CMOS, PDSO28 | Standard SRAM, 32KX8, 35ns, CMOS, PDIP28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | compliant |
| Maximum access time | 10 ns | 12 ns | 10 ns | 15 ns | 15 ns | 12 ns | 10 ns | 35 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-J28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | TSSOP | SOJ | TSSOP | TSSOP | TSSOP | SOJ | DIP |
| Encapsulate equivalent code | TSSOP28,.53,22 | TSSOP28,.53,22 | SOJ28,.34 | TSSOP28,.53,22 | TSSOP28,.53,22 | TSSOP28,.53,22 | SOJ28,.34 | DIP28,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Minimum standby current | 2 V | 2 V | 4.5 V | 2 V | 4.5 V | 2 V | 2 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | J BEND | GULL WING | GULL WING | GULL WING | J BEND | THROUGH-HOLE |
| Terminal pitch | 0.55 mm | 0.55 mm | 1.27 mm | 0.55 mm | 0.55 mm | 0.55 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | - |
| package instruction | TSSOP, TSSOP28,.53,22 | TSSOP, TSSOP28,.53,22 | SOJ, SOJ28,.34 | TSSOP, TSSOP28,.53,22 | TSSOP, TSSOP28,.53,22 | TSSOP, TSSOP28,.53,22 | - | DIP, DIP28,.3 |
| Maximum slew rate | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | - |