EEWORLDEEWORLDEEWORLD

Part Number

Search

KM68257ELTI-10

Description
Standard SRAM, 32KX8, 10ns, CMOS, PDSO28
Categorystorage    storage   
File Size392KB,8 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

KM68257ELTI-10 Overview

Standard SRAM, 32KX8, 10ns, CMOS, PDSO28

KM68257ELTI-10 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
package instructionTSSOP, TSSOP28,.53,22
Reach Compliance Codeunknown
Maximum access time10 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-G28
JESD-609 codee0
memory density262144 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP28,.53,22
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Minimum standby current2 V
Maximum slew rate0.08 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.55 mm
Terminal locationDUAL

KM68257ELTI-10 Related Products

KM68257ELTI-10 KM68257ELT-12 KM68257EJI-10 KM68257ELT-15 KM68257ET-15 KM68257ELTI-12 KM68257ELJI-10 KM68257AP-35
Description Standard SRAM, 32KX8, 10ns, CMOS, PDSO28 Standard SRAM, 32KX8, 12ns, CMOS, PDSO28 Standard SRAM, 32KX8, 10ns, CMOS, PDSO28 Standard SRAM, 32KX8, 15ns, CMOS, PDSO28 Standard SRAM, 32KX8, 15ns, CMOS, PDSO28 Standard SRAM, 32KX8, 12ns, CMOS, PDSO28 Standard SRAM, 32KX8, 10ns, CMOS, PDSO28 Standard SRAM, 32KX8, 35ns, CMOS, PDIP28
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown compliant
Maximum access time 10 ns 12 ns 10 ns 15 ns 15 ns 12 ns 10 ns 35 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G28 R-PDSO-G28 R-PDSO-J28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDSO-J28 R-PDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8 8
Number of terminals 28 28 28 28 28 28 28 28
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 70 °C 85 °C 85 °C 70 °C
organize 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP SOJ TSSOP TSSOP TSSOP SOJ DIP
Encapsulate equivalent code TSSOP28,.53,22 TSSOP28,.53,22 SOJ28,.34 TSSOP28,.53,22 TSSOP28,.53,22 TSSOP28,.53,22 SOJ28,.34 DIP28,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Minimum standby current 2 V 2 V 4.5 V 2 V 4.5 V 2 V 2 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING J BEND GULL WING GULL WING GULL WING J BEND THROUGH-HOLE
Terminal pitch 0.55 mm 0.55 mm 1.27 mm 0.55 mm 0.55 mm 0.55 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG -
package instruction TSSOP, TSSOP28,.53,22 TSSOP, TSSOP28,.53,22 SOJ, SOJ28,.34 TSSOP, TSSOP28,.53,22 TSSOP, TSSOP28,.53,22 TSSOP, TSSOP28,.53,22 - DIP, DIP28,.3
Maximum slew rate 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA -
全志V853 NPU 转换部署 YOLO V5 模型
# NPU conversion and deployment of YOLO V5 model This article takes the YOLO v5s model as an example to detail the conversion and deployment process of the ONNX model on the V853 platform. ## Model pr...
aleksib Domestic Chip Exchange
Matter unified ecosystem, is the era of "fragmentation" of smart homes coming to an end?
In the early years of smart home, various manufacturers launched different home products based on their own technologies and formed their own ecosystems. Due to the lack of unified standards in the in...
石榴姐 RF/Wirelessly
Matter is about all of us, across all brands and platforms around the world
Smart light bulbs and automated blinds can bring value to every home, but to do that, these products need to be as easy to buy and set up as regular light bulbs and blinds. They need to be simple enou...
石榴姐 RF/Wirelessly
Video: PAC5285: Small Single-Chip Motor Controller and Inverter Solution for Brushless DC Motors
Qorvo's new PAC5285 Power Application Controller (PAC) uses a highly optimized SOC device to implement BLDC or PMSM programmable motor controller and driver functions in a single integrated IC. It is ...
石榴姐 RF/Wirelessly
HPM6700 series from Pioneer Semiconductor officially merged into the OpenHarmony community backbone
Source: Pioneer Semiconductor official WeChatRecently, the code of the HPM6700 series high-performance MCU general development board launched by Shanghai Xianji Semiconductor Technology Co., Ltd. (her...
谍纸天眼 Domestic Chip Exchange
The GD32F103 chip manual must be downloaded from the official website. There are problems with the old version of the manual.
The GD32F103 chip manual must be downloaded from the official website. There are problems with the old version of the manual. The peripheral pins are not correct....
huanying GD32 MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 856  2549  1684  2056  566  18  52  34  42  12 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号