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BR10003LLD

Description
Surface Mount Bidirectional Si-Trigger-Diodes (DIAC)
File Size93KB,2 Pages
ManufacturerDIOTEC
Websitehttp://www.diotec.com/
Download Datasheet View All

BR10003LLD Overview

Surface Mount Bidirectional Si-Trigger-Diodes (DIAC)

BR100-03LLD ... BR100-04LLD
BR100-03LLD ... BR100-04LLD
Surface Mount Bidirectional Si-Trigger-Diodes (DIAC)
Bidirektionale Si-Triggerdioden für die Oberflächenmontage (DIAC)
Version 2014-04-30
Breakover voltage
Durchbruchspannung
Glass case MiniMELF
Glassgehäuse MiniMELF
Weight approx. – Gewicht ca.
28 ... 45 V
SOD-80C
0.04 g
3.5
±0.1
0.3
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
Dimensions - Maße [mm]
Please note PCN023 for change of case material and parameters:
Bitte PCN023 beachten wegen Änderung Gehäusematerial und Parameter:
http://diotec.com/tl_files/diotec/files/pdf/products/pcn/pcn023_br100-03lld_br100-04lld.pdf
Maximum ratings
Power dissipation
Verlustleistung
Peak pulse current (120 Hz pulse repetition rate)
Max. Triggerstrom (120 Hz Puls-Wiederholrate)
Operating Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
T
A
= 50°C
t
p
≤ 20 µs
P
tot
I
PM
T
j
T
S
Grenzwerte
150 mW
1
)
± 2 A
1
)
-50...+100°C
-50...+175°C
Characteristics
Breakover voltage
Durchbruchspannung
Breakover current – Durchbruchstrom
Asymmetry of breakover voltage
Unsymmetrie der Durchbruchspannung
Foldback voltage – Spannungs-Rücksprung
ΔI = I
BO
to/auf I
F
= 10 mA
Thermal resistance junction to ambient air
Wärmewiderstand Sperrschicht – umgebende Luft
Thermal resistance junction to terminal
Wärmewiderstand Sperrschicht − Anschluss
dV/dt = 10 V/µs
BR100-03LLD
BR100-04LLD
V = 98% V
BO
|V
(BO)F
– V
(BO)R
|
dV/dt = 10 V/µs
V
BO
V
BO
I
BO
ΔV
BO
ΔV
F/R
R
thA
R
thT
0.3
Kennwerte
28 ... 36 V
35 ... 45 V
< 50 µA
<3V
>5V
< 150 K/W
1
)
< 70 K/W
1
Mounted on P.C. board with 25 mm
2
copper pads at each terminal
Montage auf Leiterplatte mit 25 mm
2
Kupferbelag (Lötpad) an jedem Anschluss
http://www.diotec.com/
© Diotec Semiconductor AG
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