P25P2R2G500GD datasheet, PDF - EEWORLD Datasheet

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P25P2R2G500GD: DescriptionCeramic Capacitor, Ceramic, 50V, -1500ppm/Cel TC, 0.0000022uF, 0202; CategoryPassive components capacitor; File Size179KB，3 Pages; ManufacturerCapax Technologies Inc; Websitehttp://www.capaxtechnologies.com/; Environmental Compliance

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P25P2R2G500GD Overview

Ceramic Capacitor, Ceramic, 50V, -1500ppm/Cel TC, 0.0000022uF, 0202

P25P2R2G500GD Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Capax Technologies Inc
package instruction	, 0202
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	0.0000022 µF
Capacitor type	CERAMIC CAPACITOR
Custom functions	Bulk Packaging On Request
dielectric materials	CERAMIC
high	0.127 mm
JESD-609 code	e4
length	0.635 mm
multi-layer	No
negative tolerance	2%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	SMT
method of packing	Waffle Pack
positive tolerance	2%
Rated (DC) voltage (URdc)	50 V
size code	0202
Temperature Coefficient	-1500ppm/Cel ppm/°C
Terminal surface	Gold (Au) - with Nickel (Ni) barrier
width	0.635 mm

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Technologies, Inc

Ceramic Single-Layer

Microwave Capacitors

Parallel Plate Ceramic Single Layer Microwave Capacitors (SLCs)

are ideally suited for applications such as GaAs integrated

circuits, microwave integrated circuits, DC block, bypass, and tuning,

and RF/microwave components. The SLC design offers

increased capacitance for additional bandwidth, increased stability in

capacitance over various temperatures, and more capacitance in

smaller case sizes for greater board density.

SLCs are suitable solutions for applications that require:

•

Through 40 GHz with minimum insertion loss.

•

Specified material from a selection of fourteen standard

dielectric options.

•

Imperviousness to electrostatic discharge and more ruggedness than MOS/MNS capacitors.

•

Gold plated electrode termination, which is compatible with solder, eutectic, epoxy and wire

bonding production methods.

General Specifications

ECHANICAL

•

IGH

ELIABILITY

ESTING

Bond Strength: Exceeds MIL-STD-883,

Method 2011 Destructive Bond Pull Test

Die Shear Strength: Exceeds applicable

MIL-STD-883 requirements.

Low Voltage Humidity: Paragraph 3.17, MIL-C-49464

Burn-in/Life Test: MIL-STD-202, Method 108, Condition A/F

Solderability: MIL-STD-202, Method 208

•

Group A: 100 Hour burn-in, 100% screening.

Group B: Group A tests, solderability, bond strength,

die shear strength, and temperature coefficient.

Group C: Group B tests, thermal shock, resistance to

soldering heat, low voltage humidity, and life test.

NVIRONMENTAL

TRIPLINE

HICKNESS

ASE

IMENSIONS

Case Size

Width (W)

Length (L)

Thickness

(50V)

Thickness

(100V)

P10

.010

(.254)

.010

(.254)

.005

(.127)

.007

(.178)

Inches (mm)

P13

.013

(.330)

.013

(.330)

.005

(.127)

.007

(.178)

P15

.015

(.381)

.015

(.381)

.005

(.127)

.007

(.178)

P20

.020

(.508)

.020

(.508)

.005

(.127)

.007

(.178)

P25

.025

(.635)

.025

(.635)

.005

(.127)

.007

(.178)

P30

.030

(.762)

.030

(.762)

.005

(.127)

.007

(.178)

P35

.035

(.889)

.035

(.889)

.005

(.127)

.007

(.178)

P40

.040

(1.02)

.040

(1.02)

.005

(.127)

.007

(.178)

P50

.050

(1.27)

.050

(1.27)

—

.008

(.203)

P70

.070

(1.78)

.070

(1.78)

—

.008

(.203)

P90

.90

(2.29)

.100

(2.54)

—

.009

(.229)

PA0

.100

(2.54)

.100

(2.54)

—

.010

(.254)

** Tolerance: ±.002 (.050) or 10%

APAX

ECHNOLOGIES

, I

24842 A

IBBITTS

ALENCIA

, C

91355

661.257.7666

: 661.257.4819

WWW

APAX

ECHNOLOGIES

AGE

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