EEWORLDEEWORLDEEWORLD

Part Number

Search

89H12T3BG2ZABCG

Description
PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, BGA-324
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size437KB,30 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
Download Datasheet Parametric Compare View All

89H12T3BG2ZABCG Overview

PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, BGA-324

89H12T3BG2ZABCG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeBGA
package instruction19 X 19 MM, 1 MM PITCH, GREEN, BGA-324
Contacts324
Reach Compliance Codecompli
ECCN code3A001.A.3
Other featuresIT ALSO NEED 3.3V I/O NOMINAL SUPPLY
Address bus width
maximum clock frequency125 MHz
Drive interface standardsIEEE 1149.1AC; IEEE 1149.1
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee1
length19 mm
Humidity sensitivity level3
Number of terminals324
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply1,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height1.72 mm
Maximum slew rate781 mA
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
12-Lane 3-Port
Gen2 PCI Express® Switch
®
89HPES12T3BG2
Data Sheet
Device Overview
The 89HPES12T3BG2 is a member of IDT’s PRECISE™ family of
PCI Express® switching solutions. The PES12T3BG2 is a 12-lane, 3-
port Gen2 peripheral chip that performs PCI Express Base switching
with a feature set optimized for high performance applications such as
servers, storage, and communications/networking. It provides connec-
tivity and switching functions between a PCI Express upstream port and
two downstream ports and supports switching between downstream
ports.
Features
Block Diagram
3-Port Switch Core / 12 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
Figure 1 Internal Block Diagram
(Port 4)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
©
2009 Integrated Device Technology, Inc
*Notice: The information in this document is subject to change without notice
July 1, 2009
Advance Information
High Performance PCI Express Switch
– Twelve 5 Gbps Gen2 PCI Express lanes
– Three switch ports
• One x4 upstream port
• Two x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
On-Die Temperature Sensor
– Range of 0 to 127.5 degrees Celsius
– Three programmable temperature thresholds with over and
under temperature threshold alarms
– Automatic recording of maximum high or minimum low
temperature
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twelve 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)

89H12T3BG2ZABCG Related Products

89H12T3BG2ZABCG 89H12T3BG2ZABC 89H12T3BG2ZABCG8 89H12T3BG2ZABC8
Description PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, BGA-324 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, BGA-324 Bus Controller, PBGA324 Bus Controller, PBGA324
Is it Rohs certified? conform to incompatible conform to incompatible
Reach Compliance Code compli _compli compliant not_compliant
JESD-30 code S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609 code e1 e0 e1 e0
Humidity sensitivity level 3 3 3 3
Number of terminals 324 324 324 324
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA
Encapsulate equivalent code BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
power supply 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 781 mA 781 mA 781 mA 781 mA
surface mount YES YES YES YES
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Base Number Matches 1 1 1 1

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 702  1294  2833  1199  403  15  27  58  25  9 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号