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89H12T3BG2ZBBCG

Description
PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, MS-034AAG-1, CABGA-324
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size291KB,30 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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89H12T3BG2ZBBCG Overview

PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, MS-034AAG-1, CABGA-324

89H12T3BG2ZBBCG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeBGA
package instructionBGA, BGA324,18X18,40
Contacts324
Reach Compliance Codecompli
ECCN codeEAR99
Address bus width
Bus compatibilityPCI
maximum clock frequency125 MHz
Drive interface standardsIEEE 1149.6AC; IEEE 1149.1
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee1
length19 mm
Humidity sensitivity level3
Number of terminals324
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply1,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height1.72 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
12-Lane 3-Port
Gen2 PCI Express® Switch
®
89HPES12T3BG2
Data Sheet
Device Overview
The 89HPES12T3BG2 is a member of IDT’s PRECISE™ family of
PCI Express® switching solutions. The PES12T3BG2 is a 12-lane, 3-
port Gen2 peripheral chip that performs PCI Express Base switching
with a feature set optimized for high performance applications such as
servers, storage, and communications/networking. It provides connec-
tivity and switching functions between a PCI Express upstream port and
two downstream ports and supports switching between downstream
ports.
Features
High Performance PCI Express Switch
– Twelve 5 Gbps Gen2 PCI Express lanes
– Three switch ports
• One x4 upstream port
• Two x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Implements the following optional PCI Express features
• Advanced Error Reporting (AER) on all ports
• End-to-End CRC (ECRC)
• Access Control Services (ACS)
• Power Budgeting Enhanced Capability
• Device Serial Number Enhanced Capability
• Sub-System ID and Sub-System Vendor ID Capability
• VGA and ISA enable
• L0s and L1 ASPM
• ARI ECN
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
On-Die Temperature Sensor
– Range of 0 to 127.5 degrees Celsius
– Three programmable temperature thresholds with over and
under temperature threshold alarms
– Automatic recording of maximum high or minimum low
temperature
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
Block Diagram
3-Port Switch Core / 12 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
Figure 1 Internal Block Diagram
(Port 4)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
©
2010 Integrated Device Technology, Inc.
September 13, 2010

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