Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (I
F
) of 10 mA.
Notes:
2. Input pulse is adjusted so I
R(peak)
is equal to 10 mA.
Notes:
3. t
p
» t
rr
Figure 1. Recovery Time Equivalent Test Circuit
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2
BAT54XV2
100
I
F
, FORWARD CURRENT (mA)
I
R
, REVERSE CURRENT (mA)
1000
T
A
= 150°C
100
T
A
= 125°C
T
A
= 85°C
10
1 50°C
10
1 25°C
1.0
85°C
25°C
−40°C
−55°C
0.4
0.5
0.6
1.0
0.1
T
A
= 25°C
0.1
0.0
0.1
0.2
0.3
0.01
0
5
10
15
20
25
30
V
F
, FORWARD VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
I
FSM
, FORWARD SURGE MAX CURRENT (A)
14
C
T
, TOTAL CAPACITANCE (pF)
12
10
8
6
4
2
0
0
5
10
15
20
25
30
25
Based on square wave currents
T
J
= 25°C prior to surge
20
15
10
5
0
0.001
0.01
0.1
1
10
100
1000
V
R
, REVERSE VOLTAGE (VOLTS)
t
P
, PULSE ON TIME (ms)
Figure 4. Total Capacitance
Figure 5. Forward Surge Current
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3
BAT54XV2
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
−X−
D
−Y−
E
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
DIM
A
b
c
D
E
H
E
L
L2
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
b
0.08
1
M
2
X Y
TOP VIEW
A
c
H
E
SIDE VIEW
2X
2X
RECOMMENDED
SOLDERING FOOTPRINT*
1.80
2X
L
0.48
0.40
PACKAGE
OUTLINE
2X
L2
DIMENSION: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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