TECHNICAL DATA SHEET
1/4
STRAIGHT JACK RECEPTACLE FOR PCB
SMT TYPE - GOLD 0.2 - REEL OF 100
R210.408.012
Series :
MMT
All dimensions are in mm.
.
pn
.
ao
COMPONENTS
BODY
CENTER CONTACT
OUTER CONTACT
INSULATOR
GASKET
OTHERS PARTS
-
-
MATERIALS
PHOSPHOR BRONZE
BRASS
PHOSPHOR BRONZE
PTFE
-
-
-
-
PLATINGS (
µm
)
GOLD 0.2 OVER NICKEL 2
GOLD 0.2 OVER NICKEL 2
GOLD 0.2 OVER NICKEL 2
-
-
-
Issue :
0325 A
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
TECHNICAL DATA SHEET
2/4
STRAIGHT JACK RECEPTACLE FOR PCB
SMT TYPE - GOLD 0.2 - REEL OF 100
PACKAGING
Standard
100
Unit
‘W’ option
Other
Contact us
R210.408.012
Series :
MMT
SPECIFICATION
ELECTRICAL CHARACTERISTICS
Impedance
Frequency
VSWR
1.10
+
Insertion loss
RF leakage
-(
Voltage rating
Dielectric withstanding voltage
Insulation resistance
50
0-8
0.050
0.20
NA
170
500
5000
Ω
GHz
x F(GHz) Maxi
Veff Maxi
Veff mini
MΩ mini
ENVIRONMENTAL
Operating temperature
Hermetic seal
Panel leakage
-55/+100
° C
NA
Atm.cm3/s
NA
√F(GHz)
dB Maxi
- F(GHz)) dB Maxi
OTHERS CHARACTERISTICS
Assembly instruction
Others :
accouplt : 18Nmax / desacc. : 7Nmin
MECHANICAL CHARACTERISTICS
Center contact retention
Axial force – Mating end
Axial force – Opposite end
Torque
Recommended torque
Mating
Panel nut
NA
N mini
NA
N mini
NA
N.cm mini
NA
N.cm
NA
N.cm
Mating life
Weight
500
Cycles mini
0.100
g
Issue :
0325 A
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
TECHNICAL DATA SHEET
3/4
STRAIGHT JACK RECEPTACLE FOR PCB
SMT TYPE - GOLD 0.2 - REEL OF 100
R210.408.012
Series :
MMT
Issue :
0325 A
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
TECHNICAL DATA SHEET
4/4
STRAIGHT JACK RECEPTACLE FOR PCB
SMT TYPE - GOLD 0.2 - REEL OF 100
R210.408.012
Series :
MMT
SOLDER PROCEDURE OF MMT RECEPTACLE
IN INDUSTRIAL ENVIRONMENT
1 – Deposition of solder paste Sn Ag4 Cu0.5 on mounting zone by screen printing application.
We recommend a Low Residue Solid Flux.
We advise a thickness of 200 microns (7.800 microinches). Verify that the edges of the prined zone are
clean.
2 – Placement of the receptacle on the mounting zone with an automatic machine of « pick and place » type.
A video camera is recommanded for positioning of the component. (see page 3)
Adhesive agents must not be used on the receptacle.
3 – Soldering by infra-red reflow.
Below, please find the typical profile to use.
4 – Cleaning of printed circuit boards
5 – Verification of solder joints and position of the component by visual inspection
Note : The MMT receptacle and the MMT plug must not be mated before completion of this
procedure.
Parmeter
Temperature rising Area
Max Peak Temperature
Max dwell time @260°C
Min dwell time @235°C
Max dwell time @235°C
Temperature drop in cooling Area
Max dwell time above 100°C
Value
1 -4
260
10
20
60
-1 to - 4
420
Unit
°C/sec
°C
sec
sec
sec
°C/sec
sec
Issue :
0325 A
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.