MC54HC237JDS datasheet, PDF - EEWORLD Datasheet

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MC54HC237JDS: DescriptionIC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,CERAMIC; Categorylogic logic; File Size340KB，5 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC54HC237JDS Overview

IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,CERAMIC

MC54HC237JDS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	OTHER DECODER/DRIVER
MaximumI(ol)	0.004 A
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Prop。Delay @ Nom-Sup	75 ns
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MC54HC237JDS Related Products

	MC54HC237JDS	MC74HC237NS	MC74HC237DD	MC74HC237JDS	MC74HC237ND	MC74HC237NDS	MC74HC237DDS
Description	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,CERAMIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,SOP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,CERAMIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,HC-CMOS,SOP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	SOP, SOP16,.25
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T16	R-PDIP-T16	R-PDSO-G16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDSO-G16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER
Number of functions	1	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	16	16
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	DIP	DIP	DIP	SOP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	SOP16,.25	DIP16,.3	DIP16,.3	DIP16,.3	SOP16,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
surface mount	NO	NO	YES	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	NXP	-	-	-	NXP	NXP	NXP
Load capacitance (CL)	50 pF	-	50 pF	-	50 pF	50 pF	50 pF
MaximumI(ol)	0.004 A	-	0.004 A	-	0.004 A	0.004 A	0.004 A
Prop。Delay @ Nom-Sup	75 ns	-	63 ns	-	63 ns	63 ns	63 ns

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