Document No
TCP-XXOS006H
2012/06/28
4/17
Thin Film Chip Fuse
Issued date
Page
6.Temperatuer Derating Curve
6.1 Normal Ambient Temperature: 25℃
6.2 Operating Temperature: -20℃~105℃,whit proper Derating factor as below:
105
7.Reliability Tests
Parameter
Carrying capacity
Fusing Time
Interrupting Ability
Bending Test
Resistance to solder Heat
Solderability
Temperature Rise
Resistance to Dry Heat
Resistance to Solvent
Residual Resistance
Thermal Shock
Requirement
No fusing
Within 5sec.
No mechanical
damages
No mechanical
damages
±20%
95% coverage
minimum
<75℃
±20%
No evident damages
on protective coating
and marking
10kΩ and more
△R<
10 %
Test Method
Rated current ,4hr
200% of its rated current
After the fuse is interrupted ,rated voltage applied for
30sec again
Distance between holding points: 90mm,
Bending:3mm,1time ,30sec
260℃±5℃,10seconds
±1second
235℃±5℃, 2±0.5second
245℃±5℃, 2±0.5second (Lead Free)
100% of its rated current, Measure of surface
temperature
105℃±5℃,1000 hrs
23℃±5℃of Isopropyl alcohol 90second
Measure DC resistance after fusing
-20℃/ +25℃/+125℃/+25℃ , 10 cycles
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