EEWORLDEEWORLDEEWORLD

Part Number

Search

MPC755CRX400LE

Description
32-BIT, 400 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,61 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Download Datasheet Parametric Compare View All

MPC755CRX400LE Online Shopping

Suppliers Part Number Price MOQ In stock  
MPC755CRX400LE - - View Buy Now

MPC755CRX400LE Overview

32-BIT, 400 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

MPC755CRX400LE Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeBGA
package instructionBGA,
Contacts360
Reach Compliance Codeunknown
Other featuresALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address bus width32
bit size32
boundary scanYES
maximum clock frequency100 MHz
External data bus width64
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-CBGA-B360
JESD-609 codee0
length25 mm
low power modeYES
Humidity sensitivity level3
Number of terminals360
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)245
Certification statusCOMMERCIAL
Maximum seat height3.2 mm
speed400 MHz
Maximum supply voltage2.1 V
Minimum supply voltage1.9 V
Nominal supply voltage2 V
surface mountYES
technologyCMOS
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width25 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
D ts e t
aa h e
R c e t r lc r nc
o h se Ee to is
Ma u a t r dCo o e t
n fc u e
mp n n s
R c e tr b a d d c mp n ns ae
o h se rn e
o oet r
ma ua trd u ig ete dewaes
n fcue sn i r i/ fr
h
p rh s d f m te oiia s p l r
uc a e r
o h r n l u pi s
g
e
o R c e tr waes rce td f m
r o h se
fr e rae r
o
te oiia I. Al rce t n ae
h
r nl P
g
l e rai s r
o
d n wi tea p o a o teOC
o e t h p rv l f h
h
M.
P r aetse u igoiia fcoy
at r e td sn r n la tr
s
g
ts p o rmso R c e tr e eo e
e t rga
r o h se d v lp d
ts s lt n t g aa te p o u t
e t oui s o u rne
o
rd c
me t o e c e teOC d t s e t
es r x e d h
M aa h e.
Qu l yOv riw
ai
t
e ve
• IO- 0 1
S 90
•A 92 cr ct n
S 1 0 et ai
i
o
• Qu l e Ma ua trr Ls (
ai d
n fcues it QML MI- R -
) LP F
385
53
•C a sQ Mitr
ls
lay
i
•C a sVS a eL v l
ls
p c ee
• Qu l e S p l r Ls o D sr uos( L )
ai d u pi s it f it b tr QS D
e
i
•R c e trsacic l u pir oD A a d
o h se i
r ia s p l t L n
t
e
me t aln u t a dD A sa d r s
es lid sr n L tn ad .
y
R c e tr lcrnc , L i c mmi e t
o h se Ee t is L C s o
o
tdo
t
s p ligp o u t ta s t f c so r x e t-
u pyn rd cs h t ai y u tme e p ca
s
t n fr u lya daee u loto eoiial
i s o q ai n r q a t h s r n l
o
t
g
y
s p l db id sr ma ua trr.
u pi
e yn ut
y n fcues
T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e
h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c
g
s
o
a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n
n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -
o
o
isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -
c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a
o
s
g
t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g
i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu
o
a
r xmu ai s
n
ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig
y e a e n rd c c aa tr t , e in smuai , r a l e t .
z o
o
n
© 2 1 R cetr l t n s LC Al i t R sre 0 1 2 1
0 3 ohs E cr i , L . lRg s eevd 7 1 0 3
e e oc
h
T l r m r, l s v iw wrcl . m
o e n oe p ae it w . e c o
a
e
s
o ec

MPC755CRX400LE Related Products

MPC755CRX400LE MPC755BRX300LE MPC755CVT400LE MPC755CPX400LE
Description 32-BIT, 400 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code BGA BGA BGA BGA
package instruction BGA, BGA, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360
Contacts 360 360 360 360
Reach Compliance Code unknown unknown unknown unknown
Other features ALSO REQUIRES 2.5V OR 3.3V SUPPLY ALSO REQUIRES 2.5V OR 3.3V SUPPLY ALSO REQUIRES 2.5V OR 3.3V SUPPLY ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address bus width 32 32 32 32
bit size 32 32 32 32
boundary scan YES YES YES YES
maximum clock frequency 100 MHz 100 MHz 100 MHz 100 MHz
External data bus width 64 64 64 64
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES YES
JESD-30 code S-CBGA-B360 S-CBGA-B360 S-PBGA-B360 S-PBGA-B360
length 25 mm 25 mm 25 mm 25 mm
low power mode YES YES YES YES
Humidity sensitivity level 3 1 3 3
Number of terminals 360 360 360 360
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 245 260 260 245
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 3.2 mm 3.2 mm 2.77 mm 2.77 mm
speed 400 MHz 300 MHz 400 MHz 400 MHz
Maximum supply voltage 2.1 V 2.1 V 2.1 V 2.1 V
Minimum supply voltage 1.9 V 1.8 V 1.9 V 1.9 V
Nominal supply voltage 2 V 2 V 2 V 2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Terminal surface TIN LEAD NOT SPECIFIED TIN COPPER/TIN SILVER TIN LEAD
Terminal form BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 40 40 30
width 25 mm 25 mm 25 mm 25 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
JESD-609 code e0 - e2 e0

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1640  2319  950  2710  2325  34  47  20  55  36 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号