IC,FIFO,64X9,ASYNCHRONOUS,AC-CMOS,FP,28PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor(TI ) |
| Reach Compliance Code | compliant |
| Maximum clock frequency (fCLK) | 20 MHz |
| JESD-30 code | R-XDFP-F28 |
| JESD-609 code | e0 |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of terminals | 28 |
| word count | 64 words |
| character code | 64 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 64X9 |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL28,.4 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 3.3/5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |