S71VS/XS-R Memory Subsystem
Solutions
MirrorBit
®
1.8 Volt-only Simultaneous Read/Write,
Burst Mode Multiplexed Flash Memory and Burst Mode
pSRAM
256/128/64 Mb (16/8/4 Mb x 16-bit) Flash,
128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM
Data Sheet
S71VS/XS-R Memory Subsystem Solutions Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71VS_XS-R_00
Revision
06
Issue Date
March 11, 2009
D at a
S hee t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2
S71VS/XS-R Memory Subsystem Solutions
S71VS_XS-R_00_06 March 11, 2009
S71VS/XS-R Memory Subsystem
Solutions
MirrorBit
®
1.8 Volt-only Simultaneous Read/Write,
Burst Mode Multiplexed Flash Memory and Burst Mode
pSRAM
256/128/64 Mb (16/8/4 Mb x 16-bit) Flash,
128/64/32 Mb (8/4/2 Mb x 16-bit) pSRAM
Data Sheet
Features
Power supply voltage of 1.7 V to 1.95 V
Flash / pSRAM Burst Speed: 108 MHz, 104 MHz, 83 MHz
MCP BGA Packages
– 52 ball, 7.5 x 5.0 mm, 0.5 mm ball pitch
– 56 ball, 7.7 x 6.2 mm, 0.5 mm ball pitch
– 56 ball, 9.2 x 8.0 mm, 0.5 mm ball pitch
Operating Temperature
– Wireless, –25°C to +85°C
General Description
The S71VS-R Series is a product line of stacked Multi-Chip Package (MCP) memory solutions and consists of the following
items:
One or more S29VS-R or S29XS-R Flash memory die
One or more pSRAM
The products covered by this document are listed in the table below. For details about their specifications, please refer to their
individual datasheet for further details.
Flash Density
64 Mb
128 Mb
256 Mb
256 Mb
256 Mb
pSRAM Density
32 Mb
64 Mb
64 Mb
128 Mb
128 Mb
Product
S71VS064RB0
S71VS128RC0
S71VS256RC0
S71VS256RD0
S71XS256RD0
For detailed specifications, please refer to the individual data sheets:
Document
S29VS-R
S29XS-R
128 Mb MUX pSRAM Type 5
64 Mb MUX pSRAM Type 3
32 Mb MUX pSRAM
Publication Identification Number
S29VS_XS-R_00
S29VS_XS-R_00
pSRAM_39
muxpsram_15
CustComspec_01
Publication Number
S71VS_XS-R_00
Revision
06
Issue Date
March 11, 2009
D at a
S hee t
1.
Ordering Information
The order number is formed by a valid combinations of the following:
S71VS
256
R
C
0
ZH
K
Z0
0
Packing Type
0 = Tray
2 = 7-inch Tape and Reel
3 = 13-inch Tape and Reel
Model Number
See Valid Combinations table below
Package Modifier
T = 7.5 x 5.0, 52-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter)
K = 7.7 x 6.2, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter)
E = 9.2 x 8.0, 56-ball BGA, 0.5 mm ball pitch (0.3 mm ball diameter)
Package Type
ZH = Very Thin Fine-Pitch Ball Grid Array (VFBGA)—-1.2 mm max height with
0.5mm pitch; Lead (Pb)-free Package; Low-Halogen
AH = Very Thin Fine-Pitch Ball Grid Array (VFBGA)—-1.0 mm max height with
0.5mm pitch; Lead (Pb)-free Package; Low-Halogen
Chip Contents
0 = No content (default)
pSRAM Density
B = 32 Mb
C = 64 Mb
D = 128 Mb
Process Technology
R = 65 nm MirrorBit
®
Technology
Flash Density
256 = 256 Mb
128 = 128 Mb
64 = 64 Mb
Product Family
S71VS = Multi-Chip Product 1.8 Volt-only Simultaneous Read/Write Burst
Mode Address and Data Multiplexed (ADM) Flash Memory + pSRAM
S71XS = Multi-Chip Product 1.8V-only Simultaneous Read/Write Burst Mode,
Address-High, Address-Low Data Multiplexed (AADM) Flash Memory +
pSRAM
4
S71VS/XS-R Memory Subsystem Solutions
S71VS_XS-R_00_06 March 11, 2009
京公网安备 11010802033920号
EEWORLD
