If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Input Voltage (IN to GND)
Voltage ON/OFF to GND
Power Dissipation (Note 5)
Junction Temp. (T
J
) (Note 5)
Ambient Storage Temp.
35V
5.5V
400 mW
+150°C
−65 to +150°C
Soldering Time, Temp. (Note 6)
Wave
Infrared
Vapor Phase
ESD (Note 7)
ON/OFF
All Other Pins
4sec., 260°C
10sec., 240°C
75sec., 219°C
1.0kV
2.0kV
(Note 4)
30V
0 to 5V
−40 to +125°C
300 mW
Operating Ratings
Maximum Input Voltage (IN to GND)
Voltage ON/OFF to GND
Junction Temperature (T
J
)
Maximum Power Dissipation (Note 8)
Electrical Characteristics
LM3490-3.3, LM3490-5.0
V
IN
= V
NOM
+ 1.5V unless otherwise noted. Typicals and limits appearing in normal type apply for T
A
= T
J
= 25°C. Limits appearing
in boldface type apply over the entire junction temperature range for operation, −40 to +125°C. (Notes 9, 10, 11)
Nominal Output Voltage (V
NOM
)
Symbol
V
OUT
Parameter
Output Voltage
Conditions
1 mA
≤
I
OUT
≤
100 mA
3.30
3.17
3.14
3.43
3.46
7
25
15
40
15
40
9
25
3.3V
Typical
Limit
5.00
4.80
4.75
5.20
5.25
5.0V
Typical
Limit
Units
V
V(min)
V(min)
V(max)
V(max)
mV
mV(max)
mV
mV(max)
ΔV
OUT
ΔV
OUT
I
GND
Line Regulation
Load Regulation
Ground Pin Current
V
NOM
+ 1.5V
≤
V
IN
≤
30V,
I
OUT
= 1 mA
10 mA
≤
I
OUT
≤
100 mA
V
NOM
+ 1.5V
≤
V
IN
≤
30V,
No Load
V
ON/OFF
= 5V
V
ON/OFF
= 0V
2
4
0.1
5
0.7
0.9
1.0
2
4
0.1
5
0.7
0.9
1.0
0.9
1.1
1.2
1.1
1.2
150
0.2
0.2
mA
mA(max)
µA
µA(max)
V
V(max)
V(max)
V
V(max)
V(max)
µV
rms
V(max)
V
IN
-
V
OUT
Dropout Voltage
I
OUT
= 10 mA
I
OUT
= 100 mA
0.9
e
n
V
IL
Output Noise
Voltage
Maximum Low Level
Input Voltage at ON/
OFF
Minimum High Level
Input Voltage at ON/
OFF
V
IN
= 10V,
Bandwidth: 10 Hz to 100 kHz
100
V
IH
2.0
2.0
V(min)
I
IL
I
IH
V
ON/OFF
= 0V
V
ON/OFF
= 5V
1
−1
1
20
−1
20
µA(max)
µA
µA(max)
3
www.national.com
LM3490
LM3490-12, LM3490-15
V
IN
= V
NOM
+ 1.5V unless otherwise noted. Typicals and limits appearing in normal type apply for T
A
= T
J
= 25°C. Limits appearing
in boldface type apply over the entire junction temperature range for operation, −40 to +125°C. (Notes 9, 10, 11)
Nominal Output Voltage (V
NOM
)
Symbol
V
OUT
Parameter
Output Voltage
Conditions
1 mA
≤
I
OUT
≤
100 mA
12.00
11.52
11.40
12.48
12.60
14
40
36
60
45
75
16
40
12V
Typical
Limit
15.00
14.40
14.25
15.60
15.75
15V
Typical
Limit
Units
V
V(min)
V(min)
V(max)
V(max)
mV
mV(max)
mV
mV(max)
ΔV
OUT
ΔV
OUT
I
GND
Line Regulation
Load Regulation
V
NOM
+ 1.5V
≤
V
IN
≤
30V,
I
OUT
= 1 mA
10 mA
≤
I
OUT
≤
100 mA
Ground Pin Current V
NOM
+ 1.5V
≤
V
IN
≤
30V,
No Load
V
ON/OFF
= 5V
V
ON/OFF
= 0V
2
4
0.1
5
0.7
0.9
1.0
2
4
0.1
5
0.7
0.9
1.0
0.9
1.1
1.2
1.1
1.2
450
0.2
0.2
mA
mA(max)
µA
µA(max)
V
V(max)
V(max)
V
V(max)
V(max)
µV
rms
V(max)
V
IN
-
V
OUT
Dropout Voltage
I
OUT
= 10 mA
I
OUT
= 100 mA
0.9
e
n
V
IL
Output Noise
Voltage
Maximum Low
Level Input Voltage
at ON/OFF
Minimum High
Level Input Voltage
at ON/OFF
V
IN
= 10V,
Bandwidth: 10 Hz to 100 kHz
360
V
IH
2.0
2.0
V(min)
I
IL
I
IH
V
ON/OFF
= 0V
V
ON/OFF
= 5V
1
−1
1
20
−1
20
µA(max)
µA
µA(max)
Note 1:
The package code MA05B is internal to National Semiconductor Corporation and indicates a specific version of the SOT-23 package and associated
mechanical drawings.
Note 2:
The suffix “I” indicates the junction temperature range for operation is the industrial temperature range, −40 to +125°C. The suffix “M5” indicates the die
is packaged in the 5-lead SOT-23 package. The suffix “X” indicates the devices will be supplied in blocks of 3k units as opposed to blocks of 250 units.
Note 3:
Because the entire part number does not fit on the SOT-23 package, the SOT-23 package is marked with this code instead of the part number.
Note 4:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 5:
The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using P = (T
J
- T
A
)/θ
JA
where T
J
is the junction
temperature, T
A
is the ambient temperature, and
θ
JA
is the junction-to-ambient thermal resistance. The 400 mW rating results from substituting the Absolute
Maximum junction temperature, 150°C, for T
J
, 50°C for T
A
, and 250°C/W for
θ
JA
. More power can be safely dissipated at lower ambient temperatures. Less power
can be safely dissipated at higher ambient temperatures. The Absolute Maximum power dissipation can be increased by 4 mW for each °C below 50°C ambient.
It must be derated by 4 mW for each °C above 50°C ambient. A
θ
JA
of 250°C/W represents the worst-case condition of no heat sinking of the 5-lead plastic SOT-23
package. Heat sinking enables the safe dissipation of more power. The LM3490 actively limits its junction temperature to about 150°C.
Note 6:
Times shown are dwell times. Temperatures shown are dwell temperatures. For detailed information on soldering plastic small-outline packages, refer
to the
Packaging Databook
available from National Semiconductor Corporation.
Note 7:
For testing purposes, ESD was applied using the human-body model, a 100 pF capacitor discharged through a 1.5 kΩ resistor.
Note 8:
As with the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The 300 mW rating
appearing under Operating Ratings results from substituting the maximum junction temperature for operation, 125°C, for T
J
, 50°C for T
A
, and 250°C/W for
θ
JA
in
P = (T
J
− T
A
)/θ
JA
. More power can be dissipated at lower ambient temperatures. Less power can be dissipated at higher ambient temperatures. The maximum
power dissipation for operation appearing under Operating Ratings can be increased by 4 mW for each °C below 50°C ambient. It must be derated by 4 mW for
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