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STK11C68-C20

Description
8KX8 NON-VOLATILE SRAM, 22ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28
Categorystorage    storage   
File Size59KB,10 Pages
ManufacturerCypress Semiconductor
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STK11C68-C20 Overview

8KX8 NON-VOLATILE SRAM, 22ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28

STK11C68-C20 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Parts packaging codeDIP
package instructionDIP, DIP28,.3
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time22 ns
Other featuresSTORE/RECAL TO EEPROM SOFTWARE
JESD-30 codeR-CDIP-T28
JESD-609 codee0
length35.56 mm
memory density65536 bit
Memory IC TypeNON-VOLATILE SRAM
memory width8
Number of functions1
Number of terminals28
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height4.14 mm
Maximum standby current0.00075 A
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
STK11C68
8K x 8 nvSRAM
QuantumTrap™
CMOS
Nonvolatile Static RAM
FEATURES
• 20ns, 25ns, 35ns and 45ns Access Times
STORE
to EEPROM Initiated by Software
RECALL
to SRAM Initiated by Software or
Power Restore
• 10mA Typical I
CC
at 200ns Cycle Time
• Unlimited READ, WRITE and
RECALL
Cycles
• 1,000,000
STORE
Cycles to EEPROM
• 100-Year Data Retention over Full Industrial
Temperature Range
• Commercial and Industrial Temperatures
• 28-Pin DIP and SOIC Packages
DESCRIPTION
The Simtek STK11C68 is a fast static
RAM
with a
nonvolatile, electrically erasable
PROM
element
incorporated in each static memory cell. The
SRAM
can be read and written an unlimited number of
times, while independent nonvolatile data resides in
the
EEPROM
. Data transfers from the
SRAM
to the
EEPROM
(the
STORE
operation), or from
EEPROM
to
SRAM
(the
RECALL
operation), take place using a
software sequence. Transfers from the
EEPROM
to
the
SRAM
(the
RECALL
operation) also take place
automatically on restoration of power.
The STK11C68 is pin-compatible with industry-
standard
SRAM
s. MIL-STD-883 device is also
available (STK11C68-M).
BLOCK DIAGRAM
EEPROM ARRAY
128 x 512
PIN CONFIGURATIONS
NC
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
DQ
0
DQ
1
DQ
2
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
A
5
ROW DECODER
A
6
A
7
A
8
A
9
A
11
A
12
DQ
0
DQ
1
DQ
2
DQ
3
DQ
4
DQ
5
DQ
6
DQ
7
STORE
STATIC RAM
ARRAY
128 x 512
RECALL
STORE/
RECALL
CONTROL
SOFTWARE
DETECT
INPUT BUFFERS
COLUMN I/O
COLUMN DEC
A
0
- A
12
V
CC
W
NC
A
8
A
9
A
11
G
A
10
E
DQ
7
DQ
6
DQ
5
DQ
4
DQ
3
28 - 300 PDIP
28 - 300 CDIP
28 - 350 SOIC
PIN NAMES
A
0
- A
12
Address Inputs
Write Enable
Data In/Out
Chip Enable
Output Enable
Power (+ 5V)
Ground
W
A
0
A
1
A
2
A
3
A
4
A
10
G
E
W
DQ
0
- DQ
7
E
G
V
CC
V
SS
June 1999
4-21

STK11C68-C20 Related Products

STK11C68-C20 STK11C68-P20 STK11C68-S20
Description 8KX8 NON-VOLATILE SRAM, 22ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 8KX8 NON-VOLATILE SRAM, 22ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 8KX8 NON-VOLATILE SRAM, 22ns, PDSO28, 0.350 INCH, PLASTIC, SOIC-28
Is it Rohs certified? incompatible incompatible incompatible
Maker Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor
Parts packaging code DIP DIP SOIC
package instruction DIP, DIP28,.3 DIP, DIP28,.3 SOP, SOP28,.5
Contacts 28 28 28
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
Maximum access time 22 ns 22 ns 22 ns
Other features STORE/RECAL TO EEPROM SOFTWARE STORE/RECAL TO EEPROM SOFTWARE STORE/RECAL TO EEPROM SOFTWARE
JESD-30 code R-CDIP-T28 R-PDIP-T28 R-PDSO-G28
JESD-609 code e0 e0 e0
length 35.56 mm 34.67 mm 18.085 mm
memory density 65536 bit 65536 bit 65536 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM NON-VOLATILE SRAM
memory width 8 8 8
Number of functions 1 1 1
Number of terminals 28 28 28
word count 8192 words 8192 words 8192 words
character code 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 8KX8 8KX8 8KX8
Package body material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP SOP
Encapsulate equivalent code DIP28,.3 DIP28,.3 SOP28,.5
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240 240
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 4.14 mm 4.57 mm 2.54 mm
Maximum standby current 0.00075 A 0.00075 A 0.00075 A
Maximum slew rate 0.1 mA 0.1 mA 0.1 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED 30 30
width 7.62 mm 7.62 mm 8.765 mm
Is it lead-free? - Contains lead Contains lead
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