QL8325-6PQN208I datasheet, PDF

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QL8325-6PQN208I: DescriptionField Programmable Gate Array, 1536 CLBs, 320640 Gates, CMOS, PQFP208, 28 X 28 MM, 3.35 MM HEIGHT, 0.50 MM PITCH, MS-029, LEAD FREE, PLASTIC, QFP-208; CategoryProgrammable logic devices Programmable logic; File Size2MB，96 Pages; ManufacturerQuickLogic Corporation; Websitehttps://www.quicklogic.com; Environmental Compliance

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QL8325-6PQN208I Overview

Field Programmable Gate Array, 1536 CLBs, 320640 Gates, CMOS, PQFP208, 28 X 28 MM, 3.35 MM HEIGHT, 0.50 MM PITCH, MS-029, LEAD FREE, PLASTIC, QFP-208

QL8325-6PQN208I Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	QuickLogic Corporation
Parts packaging code	QFP
package instruction	FQFP,
Contacts	208
Reach Compliance Code	compliant
Combined latency of CLB-Max	1.4798 ns
JESD-30 code	S-PQFP-G208
JESD-609 code	e2
length	28 mm
Humidity sensitivity level	3
Configurable number of logic blocks	1536
Equivalent number of gates	320640
Number of terminals	208
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1536 CLBS, 320640 GATES
Package body material	PLASTIC/EPOXY
encapsulated code	FQFP
Package shape	SQUARE
Package form	FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)	245
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
Maximum seat height	4.1 mm
Maximum supply voltage	1.89 V
Minimum supply voltage	1.71 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN COPPER
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	28 mm

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Eclipse II Family Data Sheet

• • • • • •

Ultra-Low Power FPGA Combining Performance, Density, and

Embedded RAM

Device Highlights

Flexible Programmable Logic

• As low as 14 µA standby current

• 0.18 µm, six layer metal CMOS process

• 1.8 V VCC, 1.8/2.5/3.3 V drive capable I/O

• Up to 4,002 dedicated flip-flops

• Up to 55.3 K embedded SRAM bits

• Up to 310 I/O

• Up to 335 user available pins

• Up to 320 K system gates

• IEEE 1149.1 boundary scan testing compliant

Advanced Clock Network

• Multiple dedicated low skew clock networks

• High drive input-only networks

• Quadrant-based segmentable clock networks

• User programmable Phase Locked Loops (PLL)

Embedded Computational Units

(ECUs)

Hardwired DSP building blocks with integrated

Multiply, Add, and Accumulate functions.

Security Features

The QuickLogic products come with secure

ViaLink® technology that protects intellectual

property from design theft and reverse engineering.

No external configuration memory needed;

instant-on at power-up.

Figure 1: Eclipse II Block Diagram

PLL

Embedded RAM Blocks

Embeded Computational Units

PLL

Embedded Dual Port SRAM

• Up to twenty-four 2,304 bit dual port high

performance SRAM blocks

• RAM/ROM/FIFO wizard for automatic

configuration

• Configurable and cascadable aspect ratio

Programmable I/O

• High performance I/O cell

• Programmable slew rate control

• Programmable I/O standards:

LVTTL, LVCMOS, LVCMOS18, PCI, GTL+,

SSTL2, and SSTL3

Independent I/O banks capable of supporting

multiple standards in one device

I/O register configurations: Input, Output,

Output Enable (OE)

PLL

Fabric

Embedded RAM Blocks

PLL

www.quicklogic.com

•

Eclipse II Family Data Sheet Rev. Q

Figure 4: Cascaded RAM Modules

WDATA

WADDR

RAM

Module

(2,304 bits)

RDATA

RADDR

WDATA

RAM

Module

(2,304 bits)

RDATA

The RAM modules are dual-port, with completely independent READ and WRITE ports and separate READ

and WRITE clocks. The READ ports support asynchronous and synchronous operation, while the WRITE

ports support synchronous operation. Each port has 18 data lines and 8 address lines, allowing word lengths

of up to 18 bits and address spaces of up to 256 words. Depending on the mode selected, however, some

higher order data or address lines may not be used.

The Write Enable (WE) line acts as a clock enable for synchronous write operation. The Read Enable (RE) acts

as a clock enable for synchronous READ operation (ASYNCRD input low), or as a flow-through enable for

asynchronous READ operation (ASYNCRD input high).

Designers can cascade multiple RAM modules to increase the depth or width allowed in single modules by

connecting corresponding address lines together and dividing the words between modules.

A similar technique can be used to create depths greater than 256 words. In this case address signals higher

than the MSB are encoded onto the write enable (WE) input for WRITE operations. The READ data outputs

are multiplexed together using encoded higher READ address bits for the multiplexer SELECT signals.

The RAM blocks can be loaded with data generated internally (typically for RAM or FIFO functions) or with

data from an external PROM (typically for ROM functions).

Embedded Computational Unit (ECU)

Traditional Programmable Logic architectures do not implement arithmetic functions efficiently or effectively—

these functions require high logic cell usage while garnering only moderate performance results.

The Eclipse II architecture allows for functionality above and beyond that achievable using programmable logic

devices. By embedding a dynamically reconfigurable computational unit, the Eclipse II device can address

various arithmetic functions efficiently. This approach offers greater performance and utilization than

traditional programmable logic implementations. The embedded block is implemented at the transistor level

as shown in

Figure 5.

www.quicklogic.com

•

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