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DP3S1MX32PY5-15CI

Description
SRAM Module, 1MX32, 15ns, CMOS, SURFACE MOUNT LP STACK-80
Categorystorage    storage   
File Size2MB,6 Pages
ManufacturerB&B Electronics Manufacturing Company
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DP3S1MX32PY5-15CI Overview

SRAM Module, 1MX32, 15ns, CMOS, SURFACE MOUNT LP STACK-80

DP3S1MX32PY5-15CI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerB&B Electronics Manufacturing Company
Parts packaging codeQMA
package instructionQCCN, LCC80,.5X.97,32
Contacts80
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time15 ns
I/O typeCOMMON
JESD-30 codeR-XQMA-N80
JESD-609 codee0
memory density33554432 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals80
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX32
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeQCCN
Encapsulate equivalent codeLCC80,.5X.97,32
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
power supply3.3 V
Certification statusNot Qualified
Maximum standby current0.008 A
Minimum standby current3 V
Maximum slew rate0.9 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch0.8 mm
Terminal locationQUAD
32 Megabit CMOS SRAM
DP3S1MX32PY5
ADVANCED INFORMATION
DESCRIPTION:
The DP3S1MX32PY5 is a 1M x 32 SRAM module that utilizes the
new and innovative space saving TSOP stacking technology.
The module is constructed of two 1M x 16 SRAM’ that are
s
configured as a 1M x 32.
The DP3S1MX32PY5 module features high speed access times
with common data inputs and outputs.
PIN 1
INDEX
PIN-OUT DIAGRAM
FEATURES:
Organizations Available: 1M x 32
Access Times: 10*, 12, 15, 20ns
3.3
±
0.3** Volt Power Requirement
Fully Static Operation - No clock or refresh required
TTL-Compatible Inputs and Outputs
80-Pin Surface Mount
LP-Stack
I/O12
VDD
I/O13
I/O14
VSS
I/O15
A4
A3
A2
A1
A0
BS1
CS
VDD
WE
BS3
A19
A18
A17
A16
A15
I/O0
VDD
I/O1
I/O2
VSS
I/O3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
TOP VIEW
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
I/O11
VSS
I/O10
I/O9
VDD
I/O8
A5
A6
A7
A8
A9
BS2
OE
VSS
NU
BS0
A10
A11
A12
A13
A14
I/O7
VSS
I/O6
I/O5
VDD
I/O4
PIN NAMES
A0 - A19
I/O0 - I/O31
CS
WE
OE
BS0
BS1
BS2
BS3
V
DD
V
SS
NU.
Address Inputs
Data Input/Output
Stack Enable
Write Enable
Output Enable
Byte Select I/O0 - I/O7
Byte Select I/O8 - I/O15
Byte Select I/O16 - I/O23
Byte Select I/O24 - I/O31
Power (+3.3V)
Ground
Not Usable
BS1
BS0
WE
OE
A0-A19
CS
BS3
BS2
CE
UB
LB
WE
OE
A0-A19
CE
UB
LB
FUNCTIONAL BLOCK DIAGRAM
I/O16-I/O31
* 0°-70° only.
** 5% for 10ns only.
I/O0-I/O15
30A244-00
REV. B
This document contains information on a product under consideration for development at Dense-Pac Microsystems, Inc.
Dense-Pac reserves the right to change or discontinue information on this product without prior notice.
1

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Description SRAM Module, 1MX32, 15ns, CMOS, SURFACE MOUNT LP STACK-80 SRAM Module, 1MX32, 12ns, CMOS, SURFACE MOUNT LP STACK-80 SRAM Module, 1MX32, 12ns, CMOS, SURFACE MOUNT LP STACK-80 SRAM Module, 1MX32, 20ns, CMOS, SURFACE MOUNT LP STACK-80 SRAM Module, 1MX32, 15ns, CMOS, SURFACE MOUNT LP STACK-80 SRAM Module, 1MX32, 10ns, CMOS, SURFACE MOUNT LP STACK-80
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QMA QMA QMA QMA QMA QMA
package instruction QCCN, LCC80,.5X.97,32 QCCN, LCC80,.5X.97,32 QCCN, LCC80,.5X.97,32 QCCN, LCC80,.5X.97,32 QCCN, LCC80,.5X.97,32 QCCN, LCC80,.5X.97,32
Contacts 80 80 80 80 80 80
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 15 ns 12 ns 12 ns 20 ns 15 ns 10 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XQMA-N80 R-XQMA-N80 R-XQMA-N80 R-XQMA-N80 R-XQMA-N80 R-XQMA-N80
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1
Number of terminals 80 80 80 80 80 80
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 85 °C 85 °C 70 °C 70 °C
organize 1MX32 1MX32 1MX32 1MX32 1MX32 1MX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code QCCN QCCN QCCN QCCN QCCN QCCN
Encapsulate equivalent code LCC80,.5X.97,32 LCC80,.5X.97,32 LCC80,.5X.97,32 LCC80,.5X.97,32 LCC80,.5X.97,32 LCC80,.5X.97,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A
Minimum standby current 3 V 3 V 3 V 3 V 3 V 3.14 V
Maximum slew rate 0.9 mA 0.9 mA 0.9 mA 0.9 mA 0.9 mA 0.9 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.465 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
Maker B&B Electronics Manufacturing Company - - B&B Electronics Manufacturing Company B&B Electronics Manufacturing Company B&B Electronics Manufacturing Company

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