SN74LVC2G17YEPR datasheet, PDF

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SN74LVC2G17YEPR: DescriptionLVC/LCX/Z SERIES, DUAL 1-INPUT NON-INVERT GATE, BGA6, DSBGA-6; Categorylogic logic; File Size1MB，16 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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SN74LVC2G17YEPR Overview

LVC/LCX/Z SERIES, DUAL 1-INPUT NON-INVERT GATE, BGA6, DSBGA-6

SN74LVC2G17YEPR Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	BGA
package instruction	DSBGA-6
Contacts	6
Reach Compliance Code	unknown
series	LVC/LCX/Z
JESD-30 code	R-XBGA-B6
JESD-609 code	e0
length	1.4 mm
Logic integrated circuit type	BUFFER
Humidity sensitivity level	1
Number of functions	2
Number of entries	1
Number of terminals	6
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
propagation delay (tpd)	9.3 ns
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	0.9 mm

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SN74LVC2G17YEPR Related Products

	SN74LVC2G17YEPR	SN74LVC2G17YZPR	SN74LVC2G17YEAR	SN74LVC2G17DCKT
Description	LVC/LCX/Z SERIES, DUAL 1-INPUT NON-INVERT GATE, BGA6, DSBGA-6	LVC/LCX/Z SERIES, DUAL 1-INPUT NON-INVERT GATE, BGA6, GREEN, DSBGA-6	LVC/LCX/Z SERIES, DUAL 1-INPUT NON-INVERT GATE, BGA6, MO-211EA, DSBGA-6	LVC/LCX/Z SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, GREEN, PLASTIC, SC-70, 6 PIN
Is it lead-free?	Contains lead	Contains lead	Lead free	Lead free
Is it Rohs certified?	incompatible	conform to	incompatible	conform to
Parts packaging code	BGA	BGA	DSBGA	SOIC
package instruction	DSBGA-6	GREEN, DSBGA-6	MO-211EA, DSBGA-6	TSSOP,
Contacts	6	6	6	6
Reach Compliance Code	unknown	unknown	unknown	unknown
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-XBGA-B6	R-XBGA-B6	R-XBGA-B6	R-PDSO-G6
JESD-609 code	e0	e1	e0	e4
length	1.4 mm	1.4 mm	1.4 mm	2 mm
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER
Humidity sensitivity level	1	1	1	1
Number of functions	2	2	2	2
Number of entries	1	1	1	1
Number of terminals	6	6	6	6
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	VFBGA	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260
propagation delay (tpd)	9.3 ns	9.3 ns	9.3 ns	9.3 ns
Maximum seat height	0.5 mm	0.5 mm	0.5 mm	1.1 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	3.3 V	1.8 V	3.3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN SILVER COPPER	TIN LEAD	NICKEL PALLADIUM GOLD
Terminal form	BALL	BALL	BALL	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.65 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	0.9 mm	0.9 mm	0.9 mm	1.25 mm
Maker	Rochester Electronics	-	Rochester Electronics	Rochester Electronics

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