DM74S473N datasheet, PDF - EEWORLD Datasheet

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DM74S473N: Description512X8 OTPROM, 60ns, PDIP20, PLASTIC, DIP-20; Categorystorage storage; File Size116KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM74S473N Overview

512X8 OTPROM, 60ns, PDIP20, PLASTIC, DIP-20

DM74S473N Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP20,.3
Contacts	20
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	60 ns
JESD-30 code	R-PDIP-T20
JESD-609 code	e0
length	26.075 mm
memory density	4096 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	20
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X8
Output characteristics	OPEN-COLLECTOR
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum slew rate	0.155 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

DM74S473N Related Products

	DM74S473N	DM74S473AN	DM74S473AJ	DM74S473J	DM74S473AV	DM74S473V
Description	512X8 OTPROM, 60ns, PDIP20, PLASTIC, DIP-20	IC 512 X 8 OTPROM, 45 ns, PDIP20, PLASTIC, DIP-20, Programmable ROM	512X8 OTPROM, 45ns, CDIP20, CERAMIC, DIP-20	512X8 OTPROM, 60ns, CDIP20, CERAMIC, DIP-20	512X8 OTPROM, 45ns, PQCC20, PLASTIC, LCC-20	512X8 OTPROM, 60ns, PQCC20, PLASTIC, LCC-20
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	DIP	QLCC	QLCC
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	QCCJ, LDCC20,.4SQ	QCCJ, LDCC20,.4SQ
Contacts	20	20	20	20	20	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	60 ns	45 ns	45 ns	60 ns	45 ns	60 ns
JESD-30 code	R-PDIP-T20	R-PDIP-T20	R-GDIP-T20	R-GDIP-T20	S-PQCC-J20	S-PQCC-J20
JESD-609 code	e0	e0	e0	e0	e0	e0
length	26.075 mm	26.075 mm	24.51 mm	24.51 mm	8.89 mm	8.89 mm
memory density	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20
word count	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	512X8	512X8	512X8	512X8	512X8	512X8
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	QCCJ	QCCJ
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	LDCC20,.4SQ	LDCC20,.4SQ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	4.57 mm	4.57 mm
Maximum slew rate	0.155 mA	0.155 mA	0.155 mA	0.155 mA	0.155 mA	0.155 mA
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	8.89 mm	8.89 mm
Maker	Texas Instruments	-	-	Texas Instruments	Texas Instruments	Texas Instruments

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