D87C51 datasheet, PDF - EEWORLD Datasheet

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D87C51: DescriptionMicrocontroller, 8-Bit, UVPROM, 12MHz, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，15 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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D87C51 Overview

Microcontroller, 8-Bit, UVPROM, 12MHz, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40

D87C51 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	DIP
package instruction	DIP,
Contacts	40
Reach Compliance Code	unknown
Has ADC	NO
Address bus width	16
bit size	8
maximum clock frequency	12 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	R-GDIP-T40
JESD-609 code	e0
length	52.2605 mm
Number of I/O lines	32
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
PWM channel	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
ROM programmability	UVPROM
Maximum seat height	5.588 mm
speed	12 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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D87C51 Related Products

	D87C51	ID87C52T2	D87C52T2	P87C52T2	P87C52T2-1	D87C51-1	P87C51	IN87C51-1	N87C52T2
Description	Microcontroller, 8-Bit, UVPROM, 12MHz, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40	8-BIT, UVPROM, 12MHz, MICROCONTROLLER, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40	8-BIT, UVPROM, 12MHz, MICROCONTROLLER, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40	8-BIT, OTPROM, 12MHz, MICROCONTROLLER, PDIP40, PLASTIC, DIP-40	8-BIT, OTPROM, 16MHz, MICROCONTROLLER, PDIP40, PLASTIC, DIP-40	Microcontroller, 8-Bit, UVPROM, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40	Microcontroller, 8-Bit, OTPROM, 12MHz, CMOS, PDIP40, PLASTIC, DIP-40	Microcontroller, 8-Bit, OTPROM, 16MHz, CMOS, PQCC44, PLASTIC, LCC-44	8-BIT, OTPROM, 12MHz, MICROCONTROLLER, PQCC44, PLASTIC, LCC-44
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	LCC	LCC
package instruction	DIP,	HERMETIC SEALED, CERAMIC, DIP-40	HERMETIC SEALED, CERAMIC, DIP-40	PLASTIC, DIP-40	PLASTIC, DIP-40	DIP,	DIP,	QCCJ,	PLASTIC, LCC-44
Contacts	40	40	40	40	40	40	40	44	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Has ADC	NO	NO	NO	NO	NO	NO	NO	NO	NO
Address bus width	16	16	16	16	16	16	16	16	16
bit size	8	8	8	8	8	8	8	8	8
maximum clock frequency	12 MHz	12 MHz	12 MHz	12 MHz	16 MHz	16 MHz	12 MHz	16 MHz	12 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO	NO	NO
External data bus width	8	8	8	8	8	8	8	8	8
JESD-30 code	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-PDIP-T40	R-PDIP-T40	R-GDIP-T40	R-PDIP-T40	S-PQCC-J44	S-PQCC-J44
length	52.2605 mm	52.2605 mm	52.2605 mm	52.324 mm	52.324 mm	52.2605 mm	52.324 mm	16.5862 mm	16.5862 mm
Number of I/O lines	32	32	32	32	32	32	32	32	32
Number of terminals	40	40	40	40	40	40	40	44	44
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	70 °C	70 °C	70 °C	85 °C	70 °C
PWM channel	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	QCCJ	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	220
ROM programmability	UVPROM	UVPROM	UVPROM	OTPROM	OTPROM	UVPROM	OTPROM	OTPROM	OTPROM
Maximum seat height	5.588 mm	5.588 mm	5.588 mm	5.715 mm	5.715 mm	5.588 mm	5.715 mm	4.445 mm	4.445 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	NOT SPECIFIED
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	16.5862 mm	16.5862 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	-
speed	12 MHz	12 MHz	12 MHz	12 MHz	16 MHz	-	12 MHz	16 MHz	12 MHz
Humidity sensitivity level	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	-	2
Base Number Matches	-	1	1	1	1	1	1	-	-

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