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T7031-PEPW

Description
Support Circuit, 4 X 4 MM, MO-220, QFN-16
CategoryWireless rf/communication    Telecom circuit   
File Size564KB,16 Pages
ManufacturerAtmel (Microchip)
Environmental Compliance  
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T7031-PEPW Overview

Support Circuit, 4 X 4 MM, MO-220, QFN-16

T7031-PEPW Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAtmel (Microchip)
Parts packaging codeQFN
package instruction4 X 4 MM, MO-220, QFN-16
Contacts16
Reach Compliance Codecompliant
JESD-30 codeS-XQCC-N16
JESD-609 codee3
length4 mm
Humidity sensitivity level2
Number of functions1
Number of terminals16
Maximum operating temperature80 °C
Minimum operating temperature-30 °C
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1 mm
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesSUPPORT CIRCUIT
Temperature levelCOMMERCIAL EXTENDED
Terminal surfaceMATTE TIN
Terminal formNO LEAD
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width4 mm
Features
Frequency Range 2.4 GHz to 2.5 GHz
Supply Voltage 2.7 V to 3.6 V
21 dBm Linear Output Power for IEEE 802.11b Mode
3.5% EVM at 15.5 dBm Output Power for IEEE 802.11g Mode
On-chip Power Detector with 20 dB Dynamic Range
Power-down Mode and Biasing Control
No External Components for Input Matching
Low Profile Plastic Package QFN16 (4
×
4
×
0.9 mm)
Benefits
IEEE 802.11b WLAN
IEEE 802.11g OFDM WLAN
PC Cards, PCMCIA
2.4 GHz ISM Band Application
Electrostatic sensitive device.
Observe precautions for handling.
2.4-GHz SiGe
Power Amplifier
for 802.11b/g
WLAN Systems
T7031
Preliminary
Description
Circuitry
The PA’s is designed for low current-consumption 802.11b and 802.11g multi-mode
applications such as Mini-PCI and PCMCIA for portable devices. The low profile
plastic package with internal input matching to 50
minimizes the PCB board-space
and allows simplified integration with very few passive components. The on-chip
power-detector provides a voltage linear to the output power while the standby/bias
control logic provides power saving and shutdown as well as a linear adjustment of
output power. The PA is realized as a two stage PA with internal interstage-matching
and an open-collector output structure.
Process
The power amplifier is designed in Atmel's Silicon-Germanium (SiGe) process and
provides excellent linearity and noise performance, high gain as well as good power-
added efficiency.
Rev. 4564F–WLAN–07/04

T7031-PEPW Related Products

T7031-PEPW T7031-PEP
Description Support Circuit, 4 X 4 MM, MO-220, QFN-16 IC sige power amp wlan 16qfn
Is it lead-free? Lead free Contains lead
Is it Rohs certified? conform to incompatible
Parts packaging code QFN QFN
package instruction 4 X 4 MM, MO-220, QFN-16 HVQCCN,
Contacts 16 16
Reach Compliance Code compliant compli
JESD-30 code S-XQCC-N16 S-XQCC-N16
JESD-609 code e3 e0
length 4 mm 4 mm
Number of functions 1 1
Number of terminals 16 16
Maximum operating temperature 80 °C 80 °C
Minimum operating temperature -30 °C -30 °C
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code HVQCCN HVQCCN
Package shape SQUARE SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260 240
Certification status Not Qualified Not Qualified
Maximum seat height 1 mm 1 mm
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
Telecom integrated circuit types SUPPORT CIRCUIT SUPPORT CIRCUIT
Temperature level COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal surface MATTE TIN TIN LEAD
Terminal form NO LEAD NO LEAD
Terminal pitch 0.65 mm 0.65 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature 40 30
width 4 mm 4 mm

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