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DB3X314F

Description
Mixer Diode, L Band, Silicon, ROHS COMPLIANT, MINI3-G3-B, 3 PIN
CategoryDiscrete semiconductor    diode   
File Size408KB,4 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
Environmental Compliance  
Download Datasheet Parametric View All

DB3X314F Overview

Mixer Diode, L Band, Silicon, ROHS COMPLIANT, MINI3-G3-B, 3 PIN

DB3X314F Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerPanasonic
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeMIXER DIODE
Maximum forward voltage (VF)0.4 V
frequency bandL BAND
JESD-30 codeR-PDSO-G3
JESD-609 codee6
Humidity sensitivity level1
Maximum non-repetitive peak forward current0.15 A
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Maximum output current0.03 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum repetitive peak reverse voltage30 V
surface mountYES
technologySCHOTTKY
Terminal surfaceTIN BISMUTH
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

DB3X314F Preview

This product complies with the RoHS Directive (EU 2002/95/EC).
DB3X314F
Silicon epitaxial planar type
For high speed switching circuits
Features
Short reverse recovery time t
rr
Small reverse current I
R
Contributes to miniaturization of sets, reduction of component count.
Eco-friendly Halogen-free package
Package
Code
Mini3-G3-B
Name
Pin
1: Anode-1
2: Cathode-2
Basic Part Number
Dual DB2J314 (Series)
3: Cathode-1
Anode-2
Marking Symbol: 5C
Internal Connection
3
Packaging
Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
Absolute Maximum Ratings
T
a
= 25°C
Parameter
Reverse voltage
Maximum peak reverse voltage
Forward current
Peak forward current
Junction temperature
Storage temperature
Single
Series
Single
Series
Symbol
V
R
V
RM
I
F
I
FM
T
j
T
stg
Rating
30
30
30
20
150
110
125
–55 to +125
Unit
V
V
mA
mA
mA
mA
°C
°C
1
2
Electrical Characteristics
T
a
= 25°C±3°C
Parameter
Forward voltage
Reverse current
Terminal capacitance
Reverse recovery time
*
Symbol
V
F1
V
F2
I
R
C
t
t
rr
I
F
= 1 mA
I
F
= 30 mA
V
R
= 30 V
V
R
= 10 V, f = 1 MHz
I
F
= I
R
=10 mA, I
rr
= 1 mA,
R
L
= 100
Ω 
1.5
1.0
Conditions
Min
Typ
Max
0.4
1.0
300
Unit
V
nA
pF
ns
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage
of current from the operating equipment.
3. Absolute frequency of input and output is 2 GHz
*: t
rr
measurement circuit
Bias Application Unit (N-50BU)
t
r
10%
Input Pulse
t
p
t
I
F
Output Pulse
t
rr
t
I
rr
= 1 mA
A
V
R
Wave Form Analyzer
(SAS-8130)
R
i
= 50
ZKH00274BED
90%
t
p
= 2
µs
t
r
= 0.35 ns
δ
= 0.05
I
F
= 10 mA
I
R
= 10 mA
R
L
= 100
Pulse Generator
(PG-10N)
R
s
= 50
Publication date: July 2010
1
This product complies with the RoHS Directive (EU 2002/95/EC).
DB3X314F
DB3X314F_ I
F
-V
F
10
−1
I
F
V
F
DB3X314F_ I
R
-V
R
DB3X314F_Ct-VR
I
R
V
R
C
t
V
R
5.0
T
a
=
25°C
10
−4
10
−5
T
a
= 125°C
Forward current I
F
(A)
Reverse current I
R
(A)
10
−2
T
a
= 125°C
10
−6
10
−7
10
−8
10
−9
100°C
85°C
25°C
Terminal capacitance C
t
(pF)
4.0
3.0
10
−3
100°C
85°C
25°C
−30°C
2.0
10
−4
−30°C
10
−10
10
−11
1.0
10
−5
0
0.2
0.4
0.6
0.8
1.0
0
10
20
30
0
0
10
20
30
Forward voltage V
F
(V)
Reverse voltage V
R
(V)
Reverse voltage V
R
(V)
2
ZKH00274BED
This product complies with the RoHS Directive (EU 2002/95/EC).
DB3X314F
Mini3-G3-B
Unit: mm
0.40
−0.05
3
+0.10
0.16
−0.06
+0.10
1.50
−0.05
+0.25
2.8
−0.3
+0.2
1
2
(0.95)
1.9
±0.1
(0.95)
+0.20
2.90
−0.05
10
°
(0.65)
+0.2
0 to 0.1
1.1
−0.1
1.1
−0.1
+0.3
5
°
0.4
±0.2
ZKH00274BED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202

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