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Am29F080B-120EIB

Description
1M X 8 FLASH 5V PROM, 70 ns, PDSO40
Categorystorage    storage   
File Size222KB,37 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

Am29F080B-120EIB Overview

1M X 8 FLASH 5V PROM, 70 ns, PDSO40

Am29F080B-120EIB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeTSOP
package instructionTSOP-40
Contacts40
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time120 ns
Other featuresMINIMUM 1000000 PROGRAM/ERASE CYCLES
command user interfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G40
JESD-609 codee0
memory density8388608 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size16
Number of terminals40
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeTSSOP40,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
ready/busyYES
Department size64K
Maximum standby current0.000005 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
switch bitYES
typeNOR TYPE
PRELIMINARY
Am29F080B
8 Megabit (1 M x 8-Bit)
CMOS 5.0 Volt-only, Uniform Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s
5.0 V
±
10%, single power supply operation
— Minimizes system level power requirements
s
Manufactured on 0.35 µm process technology
— Compatible with 0.5 µm Am29F080 device
s
High performance
— Access times as fast as 70 ns
s
Low power consumption
— 25 mA typical active read current
— 30 mA typical program/erase current
— 1 µA typical standby current (standard access
time to active mode)
s
Flexible sector architecture
— 16 uniform sectors of 64 Kbytes each
— Any combination of sectors can be erased.
— Supports full chip erase
— Group sector protection:
A hardware method of locking sector groups to
prevent any program or erase operations within
that sector group
Temporary Sector Group Unprotect allows code
changes in previously locked sectors
s
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies bytes at specified addresses
s
Minimum 1,000,000 program/erase cycles per
sector guaranteed
s
Package options
— 40-pin TSOP
— 44-pin SO
s
Compatible with JEDEC standards
— Pinout and software compatible with
single-power-supply Flash standard
— Superior inadvertent write protection
s
Data# Polling and toggle bits
— Provides a software method of detecting
program or erase cycle completion
s
Ready/Busy# output (RY/BY#)
— Provides a hardware method for detecting
program or erase cycle completion
s
Erase Suspend/Erase Resume
— Suspends a sector erase operation to read data
from, or program data to, a non-erasing sector,
then resumes the erase operation
s
Hardware reset pin (RESET#)
— Resets internal state machine to the read mode
Publication#
21503
Rev:
C
Amendment/+1
Issue Date:
April 1998

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