EEWORLDEEWORLDEEWORLD

Part Number

Search

D120805B1503FPN

Description
Fixed Resistor, Metal Glaze/thick Film, 0.125W, 150000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size124KB,7 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance  
Download Datasheet Parametric View All

D120805B1503FPN Overview

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 150000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP, ROHS COMPLIANT

D120805B1503FPN Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVishay
package instructionCHIP, ROHS COMPLIANT
Reach Compliance Codeunknown
ECCN codeEAR99
JESD-609 codee4
Manufacturer's serial numberD12AP
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, PAPER, 13 INCH
Rated power dissipation(P)0.125 W
Rated temperature70 °C
resistance150000 Ω
Resistor typeFIXED RESISTOR
size code0805
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceSilver/Palladium (Ag/Pd)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage150 V
D.. AP
Vishay
Thick Film, Rectangular Chip Resistors
for Conductive Gluing
FEATURES
AgPd-Terminations for conductive gluing
Protective overglaze
Metal glaze on high quality ceramic
Compliant with “Restriction of the use of Hazardous
Substances” (RoHS) directive 2002/95/EC (issue 2004)
Excellent stability (ΔR/R
1 % for 1000 h at 70 °C)
STANDARD ELECTRICAL SPECIFICATIONS
SIZE
MODEL
INCH METRIC
POWER RATING
P
70 °C
W
0.063
D10 AP
0402
1005
LIMITING
ELEMENT
VOLTAGE
MAX.
V≅
50
RESISTANCE
TEMPERATURE
RANGE
COEFFICIENT TOLERANCE
%
Ω
ppm/K
± 100
± 200
±1
±5
100R - 10M
10R - 10M
E-SERIES
24 + 96
24
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 0.5 A
0.1
D11 AP
0603
1608
75
± 100
± 200
±1
±5
18R - 10M
3R6 - 10M
24 + 96
24
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 0.7 A
0.125
D12 AP
0805
2012
150
± 100
± 200
±1
±5
18R - 10M
3R6 - 10M
24 + 96
24
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 0.8 A
0.25
D25 AP
1206
3216
200
± 100
± 200
±1
±5
18R - 10M
3R6 - 10M
24 + 96
24
Zero-Ohm-Resistor:
R
max.
< 200 mΩ,
I
max.
= 1 A
Notes
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional time.
Marking and packaging: See appropriate catalog or web pages
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material
TECHNICAL SPECIFICATIONS
PARAMETER
Rated Dissipation at 70 °C
(3)
Limiting Element Voltage
(2)
Insulation Voltage (1 min)
Thermal Resistance
(1)
Insulation Resistance
Category Temperature Range
Failure Rate
Weight/1000 pieces
(1)
(2)
(3)
UNIT
W
V≅
V
peak
K/W
Ω
°C
h-1
g
D10 AP
0.063
50
> 75
870
D11 AP
0.10
75
> 100
550
> 10
9
- 55 to + 155
0.3 x 10
- 9
D12 AP
0.125
150
> 200
440
D25 AP
0.25
200
> 300
220
0.65
2
5.5
10
Notes
Measuring conditions in acc. to EN 140401-802
Rated voltage:
PxR
The power dissipation on the resistors generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceed.
For technical questions, contact: filmresistors.thickfilmchip@vishay.com
Document Number: 20038
Revision: 02-Sep-08
www.vishay.com
1
A very comprehensive introduction to Spartan3E
It is very useful for beginners of Xilinx FPGA....
sufuzheng FPGA/CPLD
Freescale 2009 Shenzhen FTF trip latest information
Freescale's latest consumer electronics materials for 2009 are available for download in PDF format. They are mainly about the application of Freescale's products in the consumer electronics field and...
小娜 Mobile and portable
11 Questions That Can Commonly Stuck in Hardware Engineer Interviews
[p=null, 2, center][color=rgb(51, 51, 51)][font=-apple-system-font, BlinkMacSystemFont, "][size=17px][b][b][/b][/b][/size][/font][/color][/p][p=null, 2, left][color=rgb(51, 51, 51)][font=-apple-system...
btty038 Analog electronics
Design and implementation of digital controlled DC current source
[i=s]This post was last edited by paulhyde on 2014-9-15 08:54[/i] DC current sources with good stability, high precision and preset output are often used in electronic devices. The digitally controlle...
小瑞 Electronics Design Contest
How should a novice who has just started working in mobile phone RF improve himself?
First, you should have a systematic understanding of the RF system ( such as functionality ) , then you can select some chipsets and study the connectivity among them ....
JasonYoo RF/Wirelessly
RDA COM RF transceiver realizes on-chip integration of sensitive components such as RF front-end, VCO, loop filter, etc.
The design of new generation wireless communication products is becoming more and more complex and powerful. As an important component of communication chips, highly integrated RF transceivers are cru...
songbo RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2099  302  1130  281  2096  43  7  23  6  21 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号