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WS128K32NV-20H1CA

Description
SRAM Module, 128KX32, 20ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Categorystorage    storage   
File Size462KB,8 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WS128K32NV-20H1CA Overview

SRAM Module, 128KX32, 20ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

WS128K32NV-20H1CA Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
package instruction1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time20 ns
Other featuresALSO CONFIGURABLE AS 512K X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeS-CPGA-P66
JESD-609 codee0
length27.3 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height4.6 mm
Maximum standby current0.032 A
Minimum standby current3 V
Maximum slew rate0.5 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width27.3 mm
White Electronic Designs
128Kx32 3.3V SRAM MODULE
FEATURES
Access Times of 15**, 17, 20, 25, 35ns
MIL-STD-883 Compliant Devices Available
Low Voltage Operation
Packaging
• 66-pin, PGA Type, 1.075 inch square Hermetic
Ceramic HIP (Package 400)
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880
inch) square (Package 510), 3.56mm (0.140 inch)
high.
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
Commercial, Industrial and Military Temperature
Ranges
WS128K32V-XXX
3.3 Volt Power Supply
Low Power CMOS
TTL Compatible Inputs and Outputs
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS128K32V-XG2UX - 8 grams typical
WS128K32NV-XH1X - 13 grams typical
* This product is subject to change without notice.
** Commercial and Industrial only.
FIGURE 1 – PIN CONFIGURATION FOR WS128K32NV-XH1X
Top View
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
11
22
12
WE
2
#
CS
2
#
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
#
NC
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
NC
WE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
#
WE
4
#
I/O
27
A
3
A
4
A
5
WE
3
#
CS
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
66
8
WE
1
# CS
1
#
Pin Description
56
I/O
0-31
A
0-16
WE
1-4
#
CS
1-4
#
OE#
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
WE
2
# CS
2
#
WE
3
# CS
3
#
WE
4
# CS
4
#
OE#
A
0-16
128K x 8
128K x 8
128K x 8
128K x 8
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
March 2006
Rev. 8
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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