LH540206D-80 datasheet, PDF - EEWORLD Datasheet

LH540206D-80: DescriptionFIFO, 16KX9, 80ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size89KB，2 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH540206D-80 Overview

FIFO, 16KX9, 80ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

Parameter Name	Attribute value
Maker	SHARP
package instruction	0.300 INCH, PLASTIC, DIP-28
Reach Compliance Code	unknown
Maximum access time	80 ns
Other features	RETRANSMIT
period time	100 ns
JESD-30 code	R-PDIP-T28
length	34.7 mm
memory density	147456 bit
memory width	9
Number of functions	1
Number of terminals	28
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX9
Output characteristics	TOTEM POLE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.4 mm
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

	LH540206D-80	LH540206D-65
Description	FIFO, 16KX9, 80ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 16KX9, 65ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Maker	SHARP	SHARP
package instruction	0.300 INCH, PLASTIC, DIP-28	0.300 INCH, PLASTIC, DIP-28
Reach Compliance Code	unknown	unknown
Maximum access time	80 ns	65 ns
Other features	RETRANSMIT	RETRANSMIT
period time	100 ns	80 ns
JESD-30 code	R-PDIP-T28	R-PDIP-T28
length	34.7 mm	34.7 mm
memory density	147456 bit	147456 bit
memory width	9	9
Number of functions	1	1
Number of terminals	28	28
word count	16384 words	16384 words
character code	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	16KX9	16KX9
Output characteristics	TOTEM POLE	TOTEM POLE
Exportable	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified
Maximum seat height	4.4 mm	4.4 mm
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL
width	7.62 mm	7.62 mm

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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