LH540206D-25 datasheet, PDF - EEWORLD Datasheet

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LH540206D-25: DescriptionFIFO, 16KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size88KB，2 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH540206D-25 Overview

FIFO, 16KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

LH540206D-25 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SHARP
package instruction	0.300 INCH, PLASTIC, DIP-28
Reach Compliance Code	unknown
Maximum access time	25 ns
Other features	RETRANSMIT
period time	35 ns
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	34.7 mm
memory density	147456 bit
memory width	9
Number of functions	1
Number of terminals	28
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX9
Output characteristics	TOTEM POLE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	4.4 mm
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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LH540206D-25 Related Products

	LH540206D-25	LH540206-20	LH540206-25	LH540206-35	LH540206-50	LH540206D-20	LH540206D-35	LH540206D-50
Description	FIFO, 16KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 16KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 16KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 16KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 16KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 16KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 16KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 16KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Maker	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP
package instruction	0.300 INCH, PLASTIC, DIP-28	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, PLASTIC, DIP-28	0.300 INCH, PLASTIC, DIP-28	0.300 INCH, PLASTIC, DIP-28	0.300 INCH, PLASTIC, DIP-28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	25 ns	20 ns	25 ns	35 ns	50 ns	20 ns	35 ns	50 ns
Other features	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT
period time	35 ns	30 ns	35 ns	45 ns	65 ns	30 ns	45 ns	65 ns
JESD-30 code	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28
length	34.7 mm	36 mm	36 mm	36 mm	36 mm	34.7 mm	34.7 mm	34.7 mm
memory density	147456 bit	147456 bit	147456 bit	147456 bit	147456 bit	147456 bit	147456 bit	147456 bit
memory width	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	16KX9	16KX9	16KX9	16KX9	16KX9	16KX9	16KX9	16KX9
Output characteristics	TOTEM POLE	TOTEM POLE	TOTEM POLE	TOTEM POLE	TOTEM POLE	TOTEM POLE	TOTEM POLE	TOTEM POLE
Exportable	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.4 mm	5.2 mm	5.2 mm	5.2 mm	5.2 mm	4.4 mm	4.4 mm	4.4 mm
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	7.62 mm	7.62 mm	7.62 mm
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	-
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-

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