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Am29F100B-70FE

Description
1 Megabit (128 K x 8-bit/64 K x 16-bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory
Categorystorage    storage   
File Size214KB,36 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

Am29F100B-70FE Overview

1 Megabit (128 K x 8-bit/64 K x 16-bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory

Am29F100B-70FE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeTSOP
package instructionSOP, TSSOP48,.8,20
Contacts48
Reach Compliance Codeunknow
ECCN code3A001.A.2.C
Maximum access time70 ns
Other features100K PROGRAM/ERASE CYCLES MIN ;CAN BE CONFG AS 64K X 16; BOTTOM BOOT BLOCK
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G48
JESD-609 codee0
memory density1048576 bi
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size1,2,1,1
Number of terminals48
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
ready/busyYES
reverse pinoutYES
Department size16K,8K,32K,64K
Maximum standby current0.0001 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
FINAL
Am29F100
1 Megabit (128 K x 8-bit/64 K x 16-bit)
CMOS 5.0 Volt-only, Boot Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s
Single power supply operation
— 5.0 V
±
10% for read, erase, and program
operations
— Simplifies system-level power requirements
s
High performance
— 70 ns maximum access time
s
Low power consumption
— 20 mA typical active read current for byte mode
— 28 mA typical active read current for word mode
— 30 mA typical program/erase current
— 25
µA
typical standby current
s
Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
one 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and
one 32 Kword sectors (word mode)
— Any combination of sectors can be erased
— Supports full chip erase
s
Top or bottom boot block configurations
available
s
Sector protection
— Hardware-based feature that disables/re-
enables program and erase operations in any
combination of sectors
— Sector protection/unprotection can be
implemented using standard PROM
programming equipment
— Temporary Sector Unprotect feature allows in-
system code changes in protected sectors
s
Embedded Algorithms
— Embedded Erase algorithm automatically
pre-programs and erases the chip or any
combination of designated sector
— Embedded Program algorithm automatically
programs and verifies data at specified address
s
Minimum 100,000 program/erase cycles
guaranteed
s
Package options
— 44-pin SO
— 48-pin TSOP
s
Compatible with JEDEC standards
— Pinout and software compatible with
single-power-supply flash
— Superior inadvertent write protection
s
Data# Polling and Toggle Bits
— Provides a software method of detecting
program or erase cycle completion
s
Ready/Busy pin (RY/BY#)
— Provides a hardware method for detecting
program or erase cycle completion
s
Erase Suspend/Erase Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
s
Hardware RESET# pin
— Hardware method of resetting the device to
reading array data
Publication#
18926
Rev:
C
Amendment/+2
Issue Date:
March 1998
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