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IDT72261LA20PF

Description
FIFO, 16KX9, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64
Categorystorage    storage   
File Size296KB,27 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT72261LA20PF Overview

FIFO, 16KX9, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64

IDT72261LA20PF Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionPLASTIC, TQFP-64
Contacts64
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time12 ns
Other featuresRETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
Maximum clock frequency (fCLK)50 MHz
period time20 ns
JESD-30 codeS-PQFP-G64
JESD-609 codee0
length14 mm
memory density147456 bit
Memory IC TypeOTHER FIFO
memory width9
Humidity sensitivity level3
Number of functions1
Number of terminals64
word count16384 words
character code16000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16KX9
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP64,.66SQ,32
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.017 A
Maximum slew rate0.075 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width14 mm
CMOS SuperSync FIFO
16,384 x 9
32,768 x 9
FEATURES:
IDT72261LA
IDT72271LA
Choose among the following memory organizations:
IDT72261LA 16,384 x 9
IDT72271LA 32,768 x 9
Pin-compatible with the IDT72281/72291 SuperSync FIFOs
10ns read/write cycle time (8ns access time)
Fixed, low first word data latency time
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Retransmit operation with fixed, low first word data latency time
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag
can default to one of two preselected offsets
Program partial flags by either serial or parallel means
Select IDT Standard timing (using EF and FF flags) or First
Word Fall Through timing (using OR and IR flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
Independent Read and Write clocks (permit reading and writing
simultaneously)
Available in the 64-pin Thin Quad Flat Pack (TQFP) and the 64-
pin Slim Thin Quad Flat Pack (STQFP)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
DESCRIPTION:
The IDT72261LA/72271LA are exceptionally deep, high speed, CMOS
First-In-First-Out (FIFO) memories with clocked read and write controls.
These FIFOs offer numerous improvements over previous SuperSync
FIFOs, including the following:
The limitation of the frequency of one clock input with respect to the other
has been removed. The Frequency Select pin (FS) has been removed,
thus it is no longer necessary to select which of the two clock inputs,
RCLK or WCLK, is running at the higher frequency.
The period required by the retransmit operation is now fixed and short.
The first word data latency period, from the time the first word is written
to an empty FIFO to the time it can be read, is now fixed and short. (The
variable clock cycle counting delay associated with the latency period found
on previous SuperSync devices has been eliminated on this SuperSync
family.)
FUNCTIONAL BLOCK DIAGRAM
WEN
D
0
-D
8
WCLK
LD SEN
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
WRITE CONTROL
LOGIC
RAM ARRAY
16,384 x 9
32,768 x 9
FLAG
LOGIC
WRITE POINTER
READ POINTER
READ
CONTROL
LOGIC
OUTPUT REGISTER
MRS
PRS
RT
RESET
LOGIC
RCLK
REN
OE
Q
0
-Q
8
4671 drw 01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SuperSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2002
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
SEPTEMBER 2002
DSC-4671/2

IDT72261LA20PF Related Products

IDT72261LA20PF IDT72271LA20TF IDT72271LA20PF IDT72271LA15TFI IDT72261LA15PFI IDT72271LA15PF IDT72271LA15PFI IDT72271LA15TF IDT72261LA10PF
Description FIFO, 16KX9, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, STQFP-64 FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, STQFP-64 FIFO, 16KX9, 10ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, STQFP-64 FIFO, 16KX9, 8ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFP QFP QFP QFP QFP QFP QFP QFP QFP
package instruction PLASTIC, TQFP-64 STQFP-64 PLASTIC, TQFP-64 STQFP-64 PLASTIC, TQFP-64 PLASTIC, TQFP-64 PLASTIC, TQFP-64 STQFP-64 PLASTIC, TQFP-64
Contacts 64 64 64 64 64 64 64 64 64
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 12 ns 12 ns 12 ns 10 ns 10 ns 10 ns 10 ns 10 ns 8 ns
Other features RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
Maximum clock frequency (fCLK) 50 MHz 50 MHz 50 MHz 66.7 MHz 66.7 MHz 66.7 MHz 66.7 MHz 66.7 MHz 100 MHz
period time 20 ns 20 ns 20 ns 15 ns 15 ns 15 ns 15 ns 15 ns 10 ns
JESD-30 code S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 14 mm 10 mm 14 mm 10 mm 14 mm 14 mm 14 mm 10 mm 14 mm
memory density 147456 bit 294912 bit 294912 bit 294912 bit 147456 bit 294912 bit 294912 bit 294912 bit 147456 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 9 9 9 9 9 9 9 9 9
Humidity sensitivity level 3 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 64 64 64 64 64 64 64 64 64
word count 16384 words 32768 words 32768 words 32768 words 16384 words 32768 words 32768 words 32768 words 16384 words
character code 16000 32000 32000 32000 16000 32000 32000 32000 16000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C 70 °C 70 °C
organize 16KX9 32KX9 32KX9 32KX9 16KX9 32KX9 32KX9 32KX9 16KX9
Exportable YES YES YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LFQFP LQFP LFQFP LQFP LQFP LQFP LFQFP LQFP
Encapsulate equivalent code QFP64,.66SQ,32 QFP64,.47SQ,20 QFP64,.66SQ,32 QFP64,.47SQ,20 QFP64,.6SQ,32 QFP64,.66SQ,32 QFP64,.6SQ,32 QFP64,.47SQ,20 QFP64,.66SQ,32
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240 240 240 240 240 240 240 240
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum standby current 0.017 A 0.017 A 0.017 A 0.02 A 0.02 A 0.017 A 0.02 A 0.017 A 0.017 A
Maximum slew rate 0.075 mA 0.075 mA 0.075 mA 0.075 mA 0.075 mA 0.075 mA 0.075 mA 0.075 mA 0.075 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.8 mm 0.5 mm 0.8 mm 0.5 mm 0.8 mm 0.8 mm 0.8 mm 0.5 mm 0.8 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 20 20 20 20 20 20 20 20 20
width 14 mm 10 mm 14 mm 10 mm 14 mm 14 mm 14 mm 10 mm 14 mm
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Base Number Matches - 1 1 1 1 1 1 - -

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