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L8C409KMB25

Description
FIFO, 64X9, 20ns, Asynchronous, CMOS, CQCC28, 0.450 X 0.450 INCH, CERAMIC, LCC-28
Categorystorage    storage   
File Size393KB,9 Pages
ManufacturerLOGIC Devices
Websitehttp://www.logicdevices.com/
Download Datasheet Parametric View All

L8C409KMB25 Overview

FIFO, 64X9, 20ns, Asynchronous, CMOS, CQCC28, 0.450 X 0.450 INCH, CERAMIC, LCC-28

L8C409KMB25 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLOGIC Devices
Parts packaging codeQLCC
package instructionQCCN,
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time20 ns
period time40 ns
JESD-30 codeS-CQCC-N28
length11.43 mm
memory density576 bit
memory width9
Humidity sensitivity level3
Number of functions1
Number of terminals28
word count64 words
character code64
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize64X9
Output characteristicsTOTEM POLE
ExportableNO
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height3.048 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width11.43 mm

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