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IDT72225LB15PFI

Description
FIFO, 1KX18, 10ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64
Categorystorage    storage   
File Size181KB,16 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric View All

IDT72225LB15PFI Overview

FIFO, 1KX18, 10ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64

IDT72225LB15PFI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeQFP
package instructionPLASTIC, TQFP-64
Contacts64
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time10 ns
Maximum clock frequency (fCLK)66.7 MHz
period time15 ns
JESD-30 codeS-PQFP-G64
JESD-609 codee0
length14 mm
memory density18432 bit
Memory IC TypeOTHER FIFO
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals64
word count1024 words
character code1000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1KX18
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP64,.66SQ,32
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.005 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width14 mm
IDT72205LB/72215LB/72225LB/72235LB/72245LB CMOS SyncFIFO™
256 x 18-BIT, 512 x 18, 1,024 x 18, 2,048 x 18 and 4,096 x 18
Commercial And Industrial Temperature Ranges
CMOS SyncFIFO™
256 x 18, 512 x 18, 1,024 x 18,
2,048 x 18 and 4,096 x 18
Integrated Device Technology, Inc.
IDT72205LB
IDT72215LB
IDT72225LB
IDT72235LB
IDT72245LB
FEATURES:
256 x 18-bit organization array (IDT72205LB)
512 x 18-bit organization array (IDT72215LB)
1,024 x 18-bit organization array (IDT72225LB)
2,048 x 18-bit organization array (IDT72235LB)
4,096 x 18-bit organization array (IDT72245LB)
10 ns read/write cycle time
Empty and Full flags signal FIFO status
Easily expandable in depth and width
Asynchronous or coincident read and write clocks
Programmable Almost-Empty and Almost-Full flags with
default settings
Half-Full flag capability
Dual-Port zero fall-through time architecture
Output enable puts output data bus in high-impedance
state
High-performance submicron CMOS technology
Available in a 64-lead thin quad flatpack (TQFP/STQFP)
and plastic leaded chip carrier (PLCC)
Industrial temperature range (–40
°
C to +85
°
C) is available
DESCRIPTION:
The IDT72205LB/72215LB/72225LB/72235LB/72245LB
are very high-speed, low-power First-In, First-Out (FIFO)
memories with clocked read and write controls. These FIFOs
are applicable for a wide variety of data buffering needs, such
as optical disk controllers, Local Area Networks (LANs), and
interprocessor communication.
These FIFOs have 18-bit input and output ports. The input
port is controlled by a free-running clock (WCLK), and an input
enable pin (
WEN
). Data is read into the synchronous FIFO on
every clock when
WEN
is asserted. The output port is controlled
by another clock pin (RCLK) and another enable pin (
REN
). The
read clock can be tied to the write clock for single clock
operation or the two clocks can run asynchronous of one
another for dual-clock operation. An Output Enable pin (
OE
) is
provided on the read port for three-state control of the output.
The synchronous FIFOs have two fixed flags, Empty (
EF
) and
Full (
FF
), and two programmable flags, Almost-Empty (
PAE
)
and Almost-Full (
PAF
). The offset loading of the programmable
flags is controlled by a simple state machine, and is initiated by
asserting the Load pin (
LD
). A Half-Full flag (
HF
) is available
when the FIFO is used in a single device configuration.
These devices are depth expandable using a Daisy-Chain
technique. The XI and
XO
pins are used to expand the FIFOs.
In depth expansion configuration,
FL
is grounded on the first
device and set to HIGH for all other devices in the Daisy Chain.
The IDT72205LB/72215LB/72225LB/72235LB/72245LB is
fabricated using IDT’s high-speed submicron CMOS technol-
ogy.
FUNCTIONAL BLOCK DIAGRAM
WCLK
D0-D17
INPUT REGISTER
OFFSET REGISTER
WRITE CONTROL
LOGIC
WRITE POINTER
RAM ARRAY
256 x 18, 512 x 18
1,024 x 18, 2,048 x 18
4,096 x 18
FLAG
LOGIC
/(
READ POINTER
READ CONTROL
LOGIC
)
(
)/
EXPANSION LOGIC
OUTPUT REGISTER
RESET LOGIC
Q0-Q17
SyncFIFO is a trademark and the IDT logo is a registered trademark of Integrated Device Technology, Inc
RCLK
2766 drw 01
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
©2000 Integrated Device Technology, Inc.
For latest information contact IDT's web site at www.idt.com or fax-on-demand at 408-492-8391.
MAY 2000
DSC-2766/-
1
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