FIFO, 2KX9, 40ns, Asynchronous, CMOS, CQCC32, LCC-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | QFJ |
| package instruction | LCC-32 |
| Contacts | 32 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 40 ns |
| period time | 50 ns |
| JESD-30 code | R-CQCC-N32 |
| JESD-609 code | e0 |
| length | 13.97 mm |
| memory density | 18432 bit |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX9 |
| Exportable | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| Certification status | Not Qualified |
| Maximum seat height | 3.048 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 11.43 mm |
| IDT7203LLB | IDT7203LTDB | IDT7203LDB | |
|---|---|---|---|
| Description | FIFO, 2KX9, 40ns, Asynchronous, CMOS, CQCC32, LCC-32 | FIFO, 2KX9, 40ns, Asynchronous, CMOS, CDIP28, THIN, CERDIP-28 | FIFO, 2KX9, 40ns, Asynchronous, CMOS, CDIP28, CERDIP-28 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | QFJ | DIP | DIP |
| package instruction | LCC-32 | THIN, CERDIP-28 | CERDIP-28 |
| Contacts | 32 | 28 | 28 |
| Reach Compliance Code | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 40 ns | 40 ns | 40 ns |
| period time | 50 ns | 50 ns | 50 ns |
| JESD-30 code | R-CQCC-N32 | R-GDIP-T28 | R-GDIP-T28 |
| JESD-609 code | e0 | e0 | e0 |
| length | 13.97 mm | 37.1475 mm | 37.211 mm |
| memory density | 18432 bit | 18432 bit | 18432 bit |
| memory width | 9 | 9 | 9 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 32 | 28 | 28 |
| word count | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 2KX9 | 2KX9 | 2KX9 |
| Exportable | NO | NO | NO |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCN | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 | 225 | 225 |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.048 mm | 5.08 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 20 | 20 |
| width | 11.43 mm | 7.62 mm | 15.24 mm |
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