KM75C103AJ-20 datasheet, PDF - EEWORLD Datasheet

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KM75C103AJ-20: DescriptionFIFO, 2KX9, 20ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32; Categorystorage storage; File Size408KB，14 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM75C103AJ-20 Overview

FIFO, 2KX9, 20ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32

KM75C103AJ-20 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	QFJ
package instruction	QCCJ, LDCC32,.5X.6
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	20 ns
Other features	RETRANSMIT
Maximum clock frequency (fCLK)	40 MHz
period time	30 ns
JESD-30 code	R-PQCC-J32
JESD-609 code	e0
length	13.97 mm
memory density	18432 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	32
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX9
Output characteristics	3-STATE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	3.55 mm
Maximum standby current	0.005 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.43 mm

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KM75C103AJ-20 Related Products

	KM75C103AJ-20	KM75C103AP-25	KM75C103AP-35	KM75C103AP-20	KM75C103AN-20	KM75C103AJ-25	KM75C103AJ-35	KM75C103AN-35	KM75C103AN-25
Description	FIFO, 2KX9, 20ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	FIFO, 2KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 25ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	FIFO, 2KX9, 35ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	FIFO, 2KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	FIFO, 2KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFJ	DIP	DIP	DIP	DIP	QFJ	QFJ	DIP	DIP
package instruction	QCCJ, LDCC32,.5X.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.3	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6	DIP, DIP28,.3	DIP, DIP28,.3
Contacts	32	28	28	28	28	32	32	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	20 ns	25 ns	35 ns	20 ns	20 ns	25 ns	35 ns	35 ns	25 ns
Other features	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT
Maximum clock frequency (fCLK)	40 MHz	28.6 MHz	22.2 MHz	40 MHz	40 MHz	28 MHz	22 MHz	22 MHz	28 MHz
period time	30 ns	35 ns	45 ns	30 ns	30 ns	35 ns	45 ns	45 ns	35 ns
JESD-30 code	R-PQCC-J32	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PQCC-J32	R-PQCC-J32	R-PDIP-T28	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	13.97 mm	37.1 mm	37.1 mm	37.1 mm	34.29 mm	13.97 mm	13.97 mm	34.29 mm	34.29 mm
memory density	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	32	28	28	28	28	32	32	28	28
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	DIP	DIP	DIP	DIP	QCCJ	QCCJ	DIP	DIP
Encapsulate equivalent code	LDCC32,.5X.6	DIP28,.6	DIP28,.6	DIP28,.6	DIP28,.3	LDCC32,.5X.6	LDCC32,.5X.6	DIP28,.3	DIP28,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.55 mm	5.08 mm	5.08 mm	5.08 mm	4.318 mm	3.55 mm	3.55 mm	4.318 mm	4.318 mm
Maximum standby current	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A
Maximum slew rate	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	NO	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.43 mm	15.24 mm	15.24 mm	15.24 mm	7.62 mm	11.43 mm	11.43 mm	7.62 mm	7.62 mm
Maker	SAMSUNG	-	-	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Base Number Matches	-	1	1	1	1	1	-	-	-

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