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IDT70V07S25G

Description
Dual-Port SRAM, 32KX8, 25ns, CMOS, CPGA68, 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, PGA-68
Categorystorage    storage   
File Size242KB,18 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT70V07S25G Overview

Dual-Port SRAM, 32KX8, 25ns, CMOS, CPGA68, 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, PGA-68

IDT70V07S25G Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codePGA
package instructionPGA, PGA68,11X11
Contacts68
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time25 ns
Other featuresINTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
I/O typeCOMMON
JESD-30 codeS-CPGA-P68
JESD-609 codee0
length29.464 mm
memory density262144 bit
Memory IC TypeDUAL-PORT SRAM
memory width8
Number of functions1
Number of ports2
Number of terminals68
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA68,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply3.3 V
Certification statusNot Qualified
Maximum seat height5.207 mm
Maximum standby current0.006 A
Minimum standby current3 V
Maximum slew rate0.17 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperature30
width29.464 mm
HIGH-SPEED 3.3V
32K x 8 DUAL-PORT
STATIC RAM
Integrated Device Technology, Inc.
IDT70V07S/L
FEATURES:
• True Dual-Ported memory cells which allow simulta-
neous access of the same memory location
• High-speed access
— Commercial: 25/35/55ns (max.)
• Low-power operation
— IDT70V07S
Active: 450mW (typ.)
Standby: 5mW (typ.)
— IDT70V07L
Active: 450mW (typ.)
Standby: 5mW (typ.)
• IDT70V07 easily expands data bus width to 16 bits or
more using the Master/Slave select when cascading
more than one device
• M/
S
= H for
BUSY
output flag on Master
M/
S
= L for
BUSY
input on Slave
• Busy and Interrupt Flags
• On-chip port arbitration logic
• Full on-chip hardware support of semaphore signaling
between ports
• Fully asynchronous operation from either port
• Devices are capable of withstanding greater than 2001V
electrostatic discharge
• LVTTL-compatible, single 3.3V (±0.3V) power supply
• Available in 68-pin PGA, 68-pin PLCC, and a 64-pin
TQFP
DESCRIPTION:
The IDT70V07 is a high-speed 32K x 8 Dual-Port Static
RAM. The IDT70V07 is designed to be used as a stand-alone
Dual-Port RAM or as a combination MASTER/SLAVE Dual-
Port RAM for 16-bit-or-more word systems. Using the IDT
MASTER/SLAVE Dual-Port RAM approach in 16-bit or wider
memory system applications results in full-speed, error-free
operation without the need for additional discrete logic.
FUNCTIONAL BLOCK DIAGRAM
OE
L
OE
R
R/
CE
L
R/
W
L
CE
R
W
R
I/O
0L
- I/O
7L
I/O
Control
I/O
Control
I/O
0R
-I/O
7R
BUSY
L
(1,2)
BUSY
R
Address
Decoder
15
(1,2)
A
14L
A
0L
MEMORY
ARRAY
Address
Decoder
A
14R
A
0R
15
OE
L
R/
CE
L
W
L
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE
R
R/
OE
R
W
R
SEM
R
INT
R
SEM
L
(2)
INT
L
M/
S
(2)
2943 drw 01
NOTES:
1. (MASTER):
BUSY
is output; (SLAVE):
BUSY
is input.
2.
BUSY
and
INT
outputs are non-tri-stated push-pull.
COMMERCIAL TEMPERATURE RANGE
©1996 Integrated Device Technology, Inc.
For latest information contact IDT’s web site at www.idt.com or fax-on-demand at 408-492-8391.
OCTOBER 1996
DSC-2943/3
6.37
1

IDT70V07S25G Related Products

IDT70V07S25G IDT70V07L35G IDT70V07L25G
Description Dual-Port SRAM, 32KX8, 25ns, CMOS, CPGA68, 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, PGA-68 Dual-Port SRAM, 32KX8, 35ns, CMOS, CPGA68, 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, PGA-68 Dual-Port SRAM, 32KX8, 25ns, CMOS, CPGA68, 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, PGA-68
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code PGA PGA PGA
package instruction PGA, PGA68,11X11 PGA, PGA68,11X11 PGA, PGA68,11X11
Contacts 68 68 68
Reach Compliance Code not_compliant not_compliant _compli
ECCN code EAR99 EAR99 EAR99
Maximum access time 25 ns 35 ns 25 ns
Other features INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
I/O type COMMON COMMON COMMON
JESD-30 code S-CPGA-P68 S-CPGA-P68 S-CPGA-P68
JESD-609 code e0 e0 e0
length 29.464 mm 29.464 mm 29.464 mm
memory density 262144 bit 262144 bit 262144 bi
Memory IC Type DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
memory width 8 8 8
Number of functions 1 1 1
Number of ports 2 2 2
Number of terminals 68 68 68
word count 32768 words 32768 words 32768 words
character code 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 32KX8 32KX8 32KX8
Output characteristics 3-STATE 3-STATE 3-STATE
Exportable YES YES YES
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code PGA PGA PGA
Encapsulate equivalent code PGA68,11X11 PGA68,11X11 PGA68,11X11
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 225
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 5.207 mm 5.207 mm 5.207 mm
Maximum standby current 0.006 A 0.003 A 0.003 A
Minimum standby current 3 V 3 V 3 V
Maximum slew rate 0.17 mA 0.12 mA 0.14 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form PIN/PEG PIN/PEG PIN/PEG
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location PERPENDICULAR PERPENDICULAR PERPENDICULAR
Maximum time at peak reflow temperature 30 30 30
width 29.464 mm 29.464 mm 29.464 mm

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