Microcontroller, 4-Bit, MROM, LC6500 CPU, 1.44MHz, CMOS, PDIP30
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SANYO |
| package instruction | SDIP, SDIP30,.4 |
| Reach Compliance Code | unknown |
| bit size | 4 |
| CPU series | LC6500 |
| JESD-30 code | R-PDIP-T30 |
| JESD-609 code | e0 |
| Number of terminals | 30 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SDIP |
| Encapsulate equivalent code | SDIP30,.4 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 128 |
| rom(word) | 8192 |
| ROM programmability | MROM |
| speed | 1.44 MHz |
| Maximum slew rate | 5 mA |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.78 mm |
| Terminal location | DUAL |
| LC651204N(30DIP) | LC651202F(30DIP) | LC651202N(30SOP) | LC651204L(30SOP) | LC651204F(30DIP) | LC651204L(30DIP) | LC651202L(30DIP) | LC651202L(30SOP) | |
|---|---|---|---|---|---|---|---|---|
| Description | Microcontroller, 4-Bit, MROM, LC6500 CPU, 1.44MHz, CMOS, PDIP30 | Microcontroller, 4-Bit, MROM, LC6500 CPU, 4.33MHz, CMOS, PDIP30 | Microcontroller, 4-Bit, MROM, LC6500 CPU, 1.44MHz, CMOS, PDSO30 | Microcontroller, 4-Bit, MROM, LC6500 CPU, 1MHz, CMOS, PDSO30 | Microcontroller, 4-Bit, MROM, LC6500 CPU, 4.33MHz, CMOS, PDIP30 | Microcontroller, 4-Bit, MROM, LC6500 CPU, 1MHz, CMOS, PDIP30 | Microcontroller, 4-Bit, MROM, LC6500 CPU, 1MHz, CMOS, PDIP30 | Microcontroller, 4-Bit, MROM, LC6500 CPU, 1MHz, CMOS, PDSO30 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | SDIP, SDIP30,.4 | SDIP, SDIP30,.4 | SSOP, SOP30,.4,40 | SSOP, SOP30,.4,40 | SDIP, SDIP30,.4 | SDIP, SDIP30,.4 | SDIP, SDIP30,.4 | SSOP, SOP30,.4,40 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| bit size | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| CPU series | LC6500 | LC6500 | LC6500 | LC6500 | LC6500 | LC6500 | LC6500 | LC6500 |
| JESD-30 code | R-PDIP-T30 | R-PDIP-T30 | R-PDSO-G30 | R-PDSO-G30 | R-PDIP-T30 | R-PDIP-T30 | R-PDIP-T30 | R-PDSO-G30 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SDIP | SDIP | SSOP | SSOP | SDIP | SDIP | SDIP | SSOP |
| Encapsulate equivalent code | SDIP30,.4 | SDIP30,.4 | SOP30,.4,40 | SOP30,.4,40 | SDIP30,.4 | SDIP30,.4 | SDIP30,.4 | SOP30,.4,40 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| power supply | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3/5 V | 3.3/5 V | 3/5 V | 3/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| rom(word) | 8192 | 4096 | 4096 | 8192 | 8192 | 8192 | 4096 | 4096 |
| ROM programmability | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| speed | 1.44 MHz | 4.33 MHz | 1.44 MHz | 1 MHz | 4.33 MHz | 1 MHz | 1 MHz | 1 MHz |
| Maximum slew rate | 5 mA | 6 mA | 5 mA | 4 mA | 6 mA | 4 mA | 4 mA | 4 mA |
| surface mount | NO | NO | YES | YES | NO | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| Terminal pitch | 1.78 mm | 1.78 mm | 1 mm | 1 mm | 1.78 mm | 1.78 mm | 1.78 mm | 1 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | SANYO | SANYO | - | SANYO | SANYO | SANYO | SANYO | SANYO |
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