M54HC125F1 datasheet, PDF - EEWORLD Datasheet

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M54HC125F1: DescriptionHC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDIP14, FRIT SEALED, CERAMIC, DIP-14; Categorylogic logic; File Size131KB，5 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M54HC125F1 Overview

HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDIP14, FRIT SEALED, CERAMIC, DIP-14

M54HC125F1 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	FRIT SEALED, CERAMIC, DIP-14
Contacts	14
Reach Compliance Code	not_compliant
Control type	ENABLE LOW
series	HC/UH
JESD-30 code	R-GDIP-T14
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.006 A
Number of digits	1
Number of functions	4
Number of ports	2
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2/6 V
Prop。Delay @ Nom-Sup	30 ns
propagation delay (tpd)	30 ns
Certification status	Not Qualified
Maximum seat height	5 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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M54HC125F1 Related Products

	M54HC125F1	M74HC125F1	M74HC125M1	M74HC125C1	M74HC126F1	M74HC126C1	M74HC125B1N	M74HC126B1N	M54HC126F1	M74HC126M1
Description	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDIP14, FRIT SEALED, CERAMIC, DIP-14	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDIP14, FRIT SEALED, CERAMIC, DIP-14	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, MICRO, PLASTIC, DIP-14	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PQCC20, PLASTIC, CC-20	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDIP14, FRIT SEALED, CERAMIC, DIP-14	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PQCC20, PLASTIC, CC-20	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDIP14, PLASTIC, DIP-14	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDIP14, PLASTIC, DIP-14	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDIP14, FRIT SEALED, CERAMIC, DIP-14	HC/UH SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, MICRO, PLASTIC, DIP-14
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	SOIC	QFN	DIP	QFN	DIP	DIP	DIP	SOIC
package instruction	FRIT SEALED, CERAMIC, DIP-14	FRIT SEALED, CERAMIC, DIP-14	MICRO, PLASTIC, DIP-14	PLASTIC, CC-20	DIP, DIP14,.3	PLASTIC, CC-20	PLASTIC, DIP-14	PLASTIC, DIP-14	FRIT SEALED, CERAMIC, DIP-14	SOP, SOP14,.25
Contacts	14	14	14	20	14	20	14	14	14	14
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE HIGH	ENABLE HIGH	ENABLE LOW	ENABLE HIGH	ENABLE HIGH	ENABLE HIGH
series	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH
JESD-30 code	R-GDIP-T14	R-GDIP-T14	R-PDSO-G14	S-PQCC-J20	R-GDIP-T14	S-PQCC-J20	R-PDIP-T14	R-PDIP-T14	R-GDIP-T14	R-PDSO-G14
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A
Number of digits	1	1	1	1	1	1	1	1	1	1
Number of functions	4	4	4	4	4	4	4	4	4	4
Number of ports	2	2	2	2	2	2	2	2	2	2
Number of terminals	14	14	14	20	14	20	14	14	14	14
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	125 °C	85 °C
Minimum operating temperature	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	QCCJ	DIP	QCCJ	DIP	DIP	DIP	SOP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	SOP14,.25	LDCC20,.4SQ	DIP14,.3	LDCC20,.4SQ	DIP14,.3	DIP14,.3	DIP14,.3	SOP14,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
Prop。Delay @ Nom-Sup	30 ns	25 ns	25 ns	25 ns	25 ns	25 ns	25 ns	25 ns	30 ns	25 ns
propagation delay (tpd)	30 ns	25 ns	25 ns	25 ns	25 ns	25 ns	25 ns	25 ns	30 ns	25 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5 mm	5 mm	1.75 mm	4.57 mm	5 mm	4.57 mm	5.1 mm	5.1 mm	5 mm	1.75 mm
Maximum supply voltage (Vsup)	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	NO	YES	NO	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	J BEND	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	3.9 mm	8.9662 mm	7.62 mm	8.9662 mm	7.62 mm	7.62 mm	7.62 mm	3.9 mm
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics

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