8959829BXC datasheet, PDF - EEWORLD Datasheet

8959829BXC: DescriptionStandard SRAM, 128KX8, 25ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32; Categorystorage storage; File Size38KB，1 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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8959829BXC Overview

Standard SRAM, 128KX8, 25ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32

Parameter Name	Attribute value
Maker	Micross
Parts packaging code	DIP
package instruction	DIP,
Contacts	32
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	25 ns
JESD-30 code	R-CDIP-T32
JESD-609 code	e4
length	40.64 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.34 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	PALLADIUM GOLD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

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