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L8C2011KC25

Description
FIFO, 512X9, 25ns, Asynchronous, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32
Categorystorage    storage   
File Size542KB,12 Pages
ManufacturerLOGIC Devices
Websitehttp://www.logicdevices.com/
Download Datasheet Parametric View All

L8C2011KC25 Overview

FIFO, 512X9, 25ns, Asynchronous, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32

L8C2011KC25 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLOGIC Devices
Parts packaging codeQFJ
package instructionQCCN,
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time25 ns
Other featuresRETRANSMIT
period time35 ns
JESD-30 codeR-CQCC-N32
length14 mm
memory density4608 bit
memory width9
Humidity sensitivity level3
Number of functions1
Number of terminals32
word count512 words
character code512
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512X9
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height3.048 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width11.43 mm
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