L8C200CC15 datasheet, PDF - EEWORLD Datasheet

L8C200CC15: DescriptionFIFO, 256X9, 15ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28; Categorystorage storage; File Size532KB，12 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L8C200CC15 Overview

FIFO, 256X9, 15ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	15 ns
Other features	RETRANSMIT
period time	25 ns
JESD-30 code	R-GDIP-T28
length	36.83 mm
memory density	2304 bit
memory width	9
Humidity sensitivity level	3
Number of functions	1
Number of terminals	28
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256X9
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

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