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89HPES24T3G2ZAAL

Description
PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, FCBGA-324
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,48 Pages
ManufacturerIDT (Integrated Device Technology)
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89HPES24T3G2ZAAL Overview

PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, FCBGA-324

89HPES24T3G2ZAAL Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA,
Contacts324
Reach Compliance Codenot_compliant
ECCN code3A001.A.3
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width
maximum clock frequency125 MHz
Drive interface standardsIEEE 1149.1
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee0
length19 mm
Number of terminals324
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height3.42 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
24-Lane 3-Port
Gen2 PCI Express® Switch
®
89HPES24T3G2
Data Sheet
Advance Information*
Device Overview
The 89HPES24T3G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES24T3G2 is a 24-lane, 3-port
Gen2 peripheral chip that performs PCI Express base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications systems. It provides connectivity and
switching functions between a PCI Express upstream port and two
downstream ports and supports switching between downstream ports.
Features
High Performance PCI Express Switch
– Twenty-four 5 Gbps Gen2 PCI Express lanes supporting
5 Gbps and 2.5 Gbps operation
– Up to three switch ports
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– Fully compliant with PCI Express base specification Revision
2.0
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2, or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 5 Gbps / 2.5 Gbps embedded SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
3-Port Switch Core / 24 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 48
©
2007 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
December 19, 2007
DSC 6930
Advance Information

89HPES24T3G2ZAAL Related Products

89HPES24T3G2ZAAL 89HPES24T3G2ZABL 89HPES24T3G2ZAAR 89HPES24T3G2ZABR
Description PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, FCBGA-324 PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, FCBGA-676 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-324 PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-676
Is it lead-free? Contains lead Contains lead Lead free Lead free
Is it Rohs certified? incompatible incompatible conform to conform to
Parts packaging code BGA BGA BGA BGA
package instruction BGA, BGA, BGA, BGA,
Contacts 324 676 324 676
Reach Compliance Code not_compliant not_compliant compliant not_compliant
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz
Drive interface standards IEEE 1149.1 IEEE 1149.1 IEEE 1149.1 IEEE 1149.1
JESD-30 code S-PBGA-B324 S-PBGA-B676 S-PBGA-B324 S-PBGA-B676
JESD-609 code e0 e0 e3 e1
length 19 mm 27 mm 19 mm 27 mm
Number of terminals 324 676 324 676
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 225 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.42 mm 3.22 mm 3.42 mm 3.22 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30 30
width 19 mm 27 mm 19 mm 27 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches - 1 1 1

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