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SML05SC06D3A.GRPC

Description
5A, 600V, SILICON CARBIDE, RECTIFIER DIODE, HERMETIC SEALED, CERAMIC, DLCC3, VARIANT A, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size353KB,6 Pages
ManufacturerSEMELAB
Download Datasheet Parametric View All

SML05SC06D3A.GRPC Overview

5A, 600V, SILICON CARBIDE, RECTIFIER DIODE, HERMETIC SEALED, CERAMIC, DLCC3, VARIANT A, 2 PIN

SML05SC06D3A.GRPC Parametric

Parameter NameAttribute value
MakerSEMELAB
package instructionR-CDSO-N2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresHIGH RELIABILITY
applicationGENERAL PURPOSE
ConfigurationSINGLE
Diode component materialsSILICON CARBIDE
Diode typeRECTIFIER DIODE
JESD-30 codeR-CDSO-N2
JESD-609 codee4
Maximum non-repetitive peak forward current60 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature225 °C
Minimum operating temperature-55 °C
Maximum output current5 A
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Maximum power dissipation2.96 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage600 V
surface mountYES
technologySCHOTTKY
Terminal surfaceGOLD
Terminal formNO LEAD
Terminal locationDUAL
SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
VR(max) = 600V
IF(avg) = 5A
VF(typ) = 1.5V
DLCC3 Hermetic Ceramic Surface Mount Package Designed as a
Drop In Replacement for “D-5B”/ “E-MELF” Package
No Reverse Recovery
No Forward Recovery
High Reliability Screening Options Available
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise stated)
VRRM
VRSM
IF(AVG)
IFSM
PD
TJ
Tstg
Peak Repetitive Reverse Voltage
Surge Peak Reverse Voltage
Average Forward Current
(1)
Non-Repetitive Peak Forward Surge Current
(3,4)
Total Power Dissipation at TA = 25°C
Derate Above TA = 25°C
Junction Temperature Range
Storage Temperature Range
600V
600V
5A
60A
2.96
(2)
14.8mW/°C
(2)
-55 to +225°C
-55 to +225°C
THERMAL PROPERTIES
Symbols
R
θJSP(IN)
R
θJA(PCB)
(2)
R
θJA(PCB)
(3)
Parameters
Thermal Resistance, Junction To Solder Pads TSP = 25°C
Thermal Resistance, Junction To Ambient, On PCB
Thermal Resistance, Junction To Ambient, On PCB
Max.
29
67.5
123
Units
°C/W
°C/W
°C/W
Notes
(1) IO1 is rated at 1.75A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to R
θJA(PCB)
68°C/W.
(2)
(3)
PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (25.4mm x 25.4mm) , horizontal in still air.
PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.
IO1 is rated at 1.0A @ TA = 25°C for PC boards where R
θJA(PCB)
125°C/W. Derate at 7.33mA/°C above TA = 25°C in this case.
MIL-STD-750 Method 4066.4 Condition A1. I
O
= 1A, V
RWM
= 600V, V
RSM
= 600V, ten surges of 8.3mS each at 1 minute intervals, TA = 25°C.
(4)
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.
Semelab ltd reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab ltd
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 9166
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