EEWORLDEEWORLDEEWORLD

Part Number

Search

SML1001R1AN

Description
9.5A, 1000V, 1.1ohm, N-CHANNEL, Si, POWER, MOSFET, TO-3
CategoryDiscrete semiconductor    The transistor   
File Size60KB,2 Pages
ManufacturerSEMELAB
Download Datasheet Parametric Compare View All

SML1001R1AN Overview

9.5A, 1000V, 1.1ohm, N-CHANNEL, Si, POWER, MOSFET, TO-3

SML1001R1AN Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSEMELAB
package instructionFLANGE MOUNT, O-MBFM-P2
Reach Compliance Codecompliant
Shell connectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage1000 V
Maximum drain current (ID)9.5 A
Maximum drain-source on-resistance1.1 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-3
JESD-30 codeO-MBFM-P2
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialMETAL
Package shapeROUND
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum pulsed drain current (IDM)38 A
Certification statusNot Qualified
surface mountNO
Terminal formPIN/PEG
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON

SML1001R1AN Preview

LAB
TO3 Package Outline.
Dimensions in mm (Inches)
SEME
SML1001R1AN
SML901R1AN
SML1001R3AN
SML901R3AN
1000V
900V
1000V
900V
9.5A
9.5A
8.5A
8.5A
1.10
W
1.10
W
1.30
W
1.30
W
POWER MOS IV™
N–CHANNEL
ENHANCEMENT MODE
HIGH VOLTAGE
POWER MOSFETS
MAXIMUM RATINGS
(T
case
=25°C unless otherwise stated)
Parameter
V
DSS
I
D
I
DM
V
GS
P
D
T
J
, T
STJ
Drain – Source Voltage
Continuous Drain Current
Pulsed Drain Current
1
Gate – Source Voltage
Total Power Dissipation @ T
case
= 25°C
Derate above 25°C
Operating and Storage Junction Temperature
Range
901R1AN
900
9.5
38
±30
230
SML
1001R1AN 901R3AN
1000
900
8.5
34
1001R3AN
1000
Unit
V
A
A
V
W
–55 to 150
°C
STATIC ELECTRICAL RATINGS
(T
case
=25°C unless otherwise stated)
Characteristic / Test Conditions / Part Number
Drain – Source Breakdown Voltage
SML1001R1AN / SML1001R3AN
(V
GS
= 0V , I
D
= 250
m
A)
Zero Gate Voltage Drain Current
Gate – Source Leakage Current
On State Drain Current
2
(V
DS
> I
D(ON)
x R
DS(ON)
Max , V
GS
= 10V)
Static Drain – Source On State Resistance
2
(V
GS
=10V , I
D
= 0.5 I
D
[Cont.])
SML901R1AN / SML901R3AN
(V
GS
= 0V , V
DS
= V
DSS
)
(V
GS
= 0V , V
DS
= 0.8V
DSS
, T
C
= 125°C)
(V
GS
= ±30V , V
DS
= 0V)
SML1001R1AN / SML901R1AN
SML1001R1AN / SML901R3AN
9.5
8.5
2
SML1001R1AN / SML901R1AN
SML1001R3AN / SML901R3AN
4
1.1
1.3
Min.
1000
900
250
1000
±100
Typ.
Max. Unit
V
BV
DSS
I
DSS
I
GSS
I
D(ON)
m
A
nA
A
V
V
GS(TH)
Gate Threshold Voltage
R
DS(ON)
W
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Pulse Test: Pulse Width < 380
m
S , Duty Cycle < 2%
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail:
sales@semelab.co.uk
Website:
http://www.semelab.co.uk
Prelim. 12/00
SML1001R1AN
SML901R1AN
SML1001R3AN
SML901R3AN
1000V
900V
1000V
900V
9.5A
9.5A
8.5A
8.5A
1.10
W
1.10
W
1.30
W
1.30
W
Test Conditions.
V
GS
= 0V
V
DS
= 25V
f = 1MHz
V
GS
= 10V
I
D
= I
D
[Cont.]
V
DD
= 0.5 V
DSS
V
DD
= 0.5 V
DSS
I
D
= I
D
[Cont.]
V
GS
= 15V
R
G
= 1.8
W
LAB
Min.
Typ.
2460
360
105
90
9.3
47
15
16
64
24
Max. Unit
2950
500
160
130
14
70
30
32
95
48
ns
nC
pF
SEME
DYNAMIC CHARACTERISTICS
Characteristic
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Input capacitance
Output capacitance
Reverse transfer capacitance
Total Gate Charge
3
Gate – Source Charge
Gate – Drain (“Miller”) Charge
Turn–on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
SOURCE – DRAIN DIODE RATINGS AND CHARACTERISTICS
Characteristic / Test Conditions.
I
S
I
SM
V
SD
t
rr
Q
rr
Continuous Source Current (Body Diode)
Pulsed Source Current
1
(Body Diode)
Diode Forward Voltage
2
(V
GS
= 0V , I
S
= – I
D
[Cont.])
Reverse Recovery Time
(I
S
= – I
D
[Cont.] , dl
s
/ dt = 100A/
m
s
Reverse Recovery Charge
320
2.2
636
4.5
Part Number
SML1001R1AN / SML901R1AN
SML901R3AN / SML901R3AN
SML1001R1AN / SML901R1AN
SML1001R3AN / SML901R3AN
Min.
Typ.
Max. Unit
9.5
A
8.5
38
34
1.3
A
V
1200
9
ns
m
C
SAFE OPERATING AREA CHARACTERISTICS
SOA1
SOA2
I
LM
Characteristic / Test Conditions / Part Number
Safe Operating Area
V
DS
= 0.4 V
DSS
, I
DS
= P
D
/ 0.4 V
DSS
, t = 1 Sec
Safe Operating Area
Inductive Current Clamped
I
DS
= I
DS
[Cont.] , V
DS
= P
D
/ I
D
[Cont.] , t = 1 Sec
SML1001R1AN / SML901R1AN
SML1001R3AN / SML901R3AN
Min.
230
230
38
34
Typ.
Max. Unit
W
A
THERMAL CHARACTERISTICS
(T
case
=25°C unless otherwise stated)
R
q
JC
R
q
JA
T
L
Characteristic / Test Conditions.
Junction to Case
Junction to Ambient
Max. Lead Temperature for Soldering Conditions: 0.065” from Case for 10 sec.
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Pulse Test: Pulse Width < 380
m
S , Duty Cycle < 2%
3) See MIL–STD–750 Method 3471
Min.
Typ.
Max. Unit
0.53 °C/W
30
300
°C/W
°C
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail:
sales@semelab.co.uk
Website:
http://www.semelab.co.uk
Prelim. 12/00

SML1001R1AN Related Products

SML1001R1AN SML1001R3AN SML901R3AN SML901R1AN
Description 9.5A, 1000V, 1.1ohm, N-CHANNEL, Si, POWER, MOSFET, TO-3 8.5A, 1000V, 1.3ohm, N-CHANNEL, Si, POWER, MOSFET, TO-3 8.5A, 900V, 1.3ohm, N-CHANNEL, Si, POWER, MOSFET, TO-3 9.5A, 900V, 1.1ohm, N-CHANNEL, Si, POWER, MOSFET, TO-3
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker SEMELAB SEMELAB SEMELAB SEMELAB
package instruction FLANGE MOUNT, O-MBFM-P2 FLANGE MOUNT, O-MBFM-P2 FLANGE MOUNT, O-MBFM-P2 FLANGE MOUNT, O-MBFM-P2
Reach Compliance Code compliant compliant compliant compli
Shell connection DRAIN DRAIN DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage 1000 V 1000 V 900 V 900 V
Maximum drain current (ID) 9.5 A 8.5 A 8.5 A 9.5 A
Maximum drain-source on-resistance 1.1 Ω 1.3 Ω 1.3 Ω 1.1 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 code TO-3 TO-3 TO-3 TO-3
JESD-30 code O-MBFM-P2 O-MBFM-P2 O-MBFM-P2 O-MBFM-P2
Number of components 1 1 1 1
Number of terminals 2 2 2 2
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 150 °C 150 °C 150 °C 150 °C
Package body material METAL METAL METAL METAL
Package shape ROUND ROUND ROUND ROUND
Package form FLANGE MOUNT FLANGE MOUNT FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Polarity/channel type N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
Maximum pulsed drain current (IDM) 38 A 34 A 34 A 38 A
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO
Terminal form PIN/PEG PIN/PEG PIN/PEG PIN/PEG
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Transistor component materials SILICON SILICON SILICON SILICON

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1187  709  2127  78  774  24  15  43  2  16 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号